电路板间隔柱、堆叠器(板对板)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 位置数量 | 间距 | 行数 | 行间距 | 引脚总长度 | 引脚长度 - 配对部分 | 堆叠高度长度 | 引脚尾部长度 | 安装类型 | 端接方式 | 触点表面处理 - 配对部分 | 触点表面处理厚度 - 配对部分 | 颜色 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DW-16-12-T-S-750CONN HDR 16POS 0.1 STACK T/H TIN |
10 |
|
|
Flex Stack, DW | Bulk | Active | 16 | 0.100" (2.54mm) | 1 | - | 1.030" (26.162mm) | 0.170" (4.318mm) | 0.750" (19.050mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
HW-04-15-L-D-250-SM-ACONN HDR 8POS 0.1 STACK SMD GOLD |
315 |
|
|
Flex Stack, HW | Bulk | Active | 8 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.565" (14.351mm) | 0.315" (8.000mm) | 0.250" (6.350mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
TW-05-04-L-S-320-SM-P-TRFLEXIBLE SURFACE MOUNT BOARD STA |
150 |
|
|
Flex Stack, TW | Strip | Active | 5 | 0.079" (2.00mm) | 1 | - | 0.487" (12.370mm) | 0.167" (4.242mm) | 0.320" (8.128mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
FW-05-05-F-D-450-190CONN HDR 10POS 0.05 STACK SMD |
544 |
|
|
Flex Stack, FW | Tube | Active | 10 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.640" (16.256mm) | 0.190" (4.826mm) | 0.450" (11.430mm) | - | Surface Mount | Solder | Gold | 3.00µin (0.076µm) | Black |
|
2012-2X10G00S/021/062/OPIN HEADER, DOUBLE ROW, 20 PIN, |
1,706 |
|
|
2012 | Bulk | Active | 20 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.244" (6.200mm) | - | 0.083" (2.100mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-2X13G00S/030/060/TPIN HEADER, DOUBLE ROW, 26 PIN, |
603 |
|
|
2012 | Bulk | Active | 26 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.236" (6.000mm) | - | 0.118" (3.000mm) | Through Hole | Solder | Gold | Flash | Black |
|
DW-10-14-T-D-1165CONN HDR 20POS 0.1 STACK T/H TIN |
15 |
|
|
Flex Stack, DW | Bulk | Active | 20 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.430" (36.322mm) | 0.155" (3.937mm) | 1.165" (29.591mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
2012-2X10G00S/031/066/PPIN HEADER, DOUBLE ROW, 20 PIN, |
492 |
|
|
2012 | Bulk | Active | 20 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.260" (6.600mm) | - | 0.122" (3.100mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-1X06G00S/028/023/GPIN HEADER, SINGLE ROW, 6 PIN, S |
5,997 |
|
|
2012 | Bulk | Active | 6 | 0.100" (2.54mm) | 1 | - | - | 0.091" (2.300mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
5-146509-6CONN HDR 12POS 0.1 STACK T/H |
1,800 |
|
|
AMPMODU Mod II | Bulk | Obsolete | 12 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.430" (36.322mm) | 0.330" (8.382mm) | 1.000" (25.400mm) | 0.100" (2.540mm) | Through Hole | Solder | Gold | 15.0µin (0.38µm) | Black |
|
2012-1X18G00S/083/045R/I24PIN HEADER, SINGLE ROW, 18 PIN, |
2,657 |
|
|
2012 | Bulk | Active | 18 | - | 1 | - | - | 0.177" (4.500mm) | - | 0.327" (8.300mm) | Through Hole | Solder | Gold | Flash | - |
|
EW-09-09-L-S-275CONN HDR 9POS 0.1 STACK T/H GOLD |
249 |
|
|
Flex Stack, EW | Bulk | Active | 9 | 0.100" (2.54mm) | 1 | - | 0.730" (18.542mm) | 0.125" (3.175mm) | 0.275" (6.985mm) | 0.330" (8.382mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
FW-10-03-G-D-215-158-TRFLEXIBLE MICRO BOARD STACKING HE |
375 |
|
|
Flex Stack, FW | Tape & Reel (TR) | Active | 20 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.373" (9.474mm) | 0.158" (4.013mm) | 0.215" (5.461mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
2012-2X16G00S-2.9-4.6-22.6BPIN HEADER, DOUBLE ROW, 32 PIN, |
130 |
|
|
2012 | Bulk | Active | 32 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.890" (22.606mm) | 0.181" (4.600mm) | 0.594" (15.100mm) | 0.114" (2.900mm) | Through Hole | Solder | Gold | Flash | Black |
|
BSTCM-224-D-160-28-H-255-AP-LF.079 Header |
280 |
|
|
BSTCM-2 | Bag | Active | 48 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.467" (11.862mm) | 0.160" (4.064mm) | 0.255" (6.477mm) | - | Surface Mount | Solder | Gold | 30.0µin (0.76µm) | Black |
|
2114-2X20G00D/069/118T-PPIN HEADER, DOUBLE ROW, 40 PIN, |
1,000 |
|
|
2114 | Bulk | Active | 40 | - | 2 | - | 0.465" (11.800mm) | 0.272" (6.900mm) | - | - | Surface Mount | Solder | Gold | Flash | - |
|
HW-08-14-G-D-1300-055CONN BRD STACK .100" 16POS |
567 |
|
|
Flex Stack, HW | Bulk | Active | 16 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.430" (36.322mm) | 0.075" (1.905mm) | 1.300" (33.020mm) | 0.055" (1.400mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
2012-1X40G00S/028/023/OPIN HEADER, SINGLE ROW, 40 PIN, |
2,973 |
|
|
2012 | Bulk | Active | 40 | 0.100" (2.54mm) | 1 | - | - | 0.091" (2.300mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
TW-06-02-G-D-125-065CONN BRD STACK 2.00 12POS |
356 |
|
|
TW | Bulk | Active | 12 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.377" (9.576mm) | 0.187" (4.750mm) | 0.125" (3.175mm) | 0.065" (1.651mm) | Through Hole | Solder | Gold | 20.0µin (0.51µm) | Black |
|
FW-25-03-G-D-250-150-A-P-TRCONN HDR 50POS 0.05 STACK SMD |
200 |
|
|
Flex Stack, FW | Tape & Reel (TR) | Active | 50 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.400" (10.160mm) | 0.150" (3.810mm) | 0.250" (6.350mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
分类概览
电路板间隔柱、堆叠器(板对板) 产品与选型指南
电路板间隔柱、堆叠器(板对板) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 电路板间隔柱、堆叠器(板对板)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 电路板间隔柱、堆叠器(板对板)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
