电路板间隔柱、堆叠器(板对板)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 位置数量 | 间距 | 行数 | 行间距 | 引脚总长度 | 引脚长度 - 配对部分 | 堆叠高度长度 | 引脚尾部长度 | 安装类型 | 端接方式 | 触点表面处理 - 配对部分 | 触点表面处理厚度 - 配对部分 | 颜色 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2012-1X02G00S-2.8-5.6-21.1B-HTPIN HEADER, SINGLE ROW, 2 PIN, S |
3,061 |
|
|
2012 | Bulk | Active | 2 | 0.100" (2.54mm) | 1 | - | 0.831" (21.100mm) | 0.220" (5.600mm) | 0.500" (12.700mm) | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-1X02G00S/040/090/NPIN HEADER, SINGLE ROW, 2 PIN, S |
2,644 |
|
|
2012 | Bulk | Active | 2 | 0.100" (2.54mm) | 1 | - | - | 0.354" (9.000mm) | - | 0.157" (4.000mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-1X03G00S/028/023/GPIN HEADER, SINGLE ROW, 3 PIN, S |
6,000 |
|
|
2012 | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | - | 0.091" (2.300mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
879370502CGRID HRD SRDW THOLE 2.54SNLF 5C |
8,050 |
|
|
* | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
2012-1X03G00S/2.8/3.4/JPIN HEADER, SINGLE ROW, 3 PIN, S |
14,171 |
|
|
2012 | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | - | 0.134" (3.400mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-2X02G00S-030-056JPIN HEADER, DOUBLE ROW, 4 PIN, S |
2,876 |
|
|
2012 | Bulk | Active | 4 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.220" (5.600mm) | - | 0.118" (3.000mm) | Through Hole | Solder | Gold | Flash | Black |
|
DW-03-10-T-S-400CONN HDR 3POS 0.1 STACK T/H TIN |
1,794 |
|
|
Flex Stack, DW | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | 0.830" (21.082mm) | 0.320" (8.128mm) | 0.400" (10.160mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
2012-1X04G00S/028/031/QPIN HEADER, SINGLE ROW, 4 PIN, S |
10,410 |
|
|
2012 | Bulk | Active | 4 | 0.100" (2.54mm) | 1 | - | - | 0.122" (3.100mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
BSTCM-605-D-08-GT-260-TR-P-LF.050 x .100 Header |
1,497 |
|
|
BSTCM-6 | Bag | Active | 10 | 0.050" (1.27mm) | 2 | 0.100" (2.54mm) | 0.435" (11.049mm) | 0.175" (4.445mm) | 0.260" (6.600mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
2114-2X12G00S-2.8-8-17.1BPIN HEADER, DOUBLE ROW, 24 PIN, |
2,140 |
|
|
2114 | Bulk | Active | 24 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.673" (17.100mm) | 0.315" (8.000mm) | 0.248" (6.300mm) | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-2X07G00S/2.8/2.3/EPIN HEADER, DOUBLE ROW, 14 PIN, |
5,970 |
|
|
2012 | Bulk | Active | 14 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.091" (2.300mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-1X14G00S/028/053/KPIN HEADER, SINGLE ROW, 14 PIN, |
2,492 |
|
|
2012 | Bulk | Active | 14 | 0.100" (2.54mm) | 1 | - | - | 0.209" (5.300mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-2X07G00S-030-056JPIN HEADER, DOUBLE ROW, 14 PIN, |
1,620 |
|
|
2012 | Bulk | Active | 14 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.220" (5.600mm) | - | 0.118" (3.000mm) | Through Hole | Solder | Gold | Flash | Black |
|
2114-2X16G00S-3-3-17.5BPIN HEADER, DOUBLE ROW, 32 PIN, |
958 |
|
|
2114 | Bulk | Active | 32 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.689" (17.500mm) | 0.118" (3.000mm) | 0.453" (11.500mm) | 0.118" (3.000mm) | Through Hole | Solder | Gold | Flash | Black |
|
2114-2X16G00S-3.2-3.2-12BPIN HEADER, DOUBLE ROW, 32 PINS, |
485 |
|
|
2114 | Bulk | Active | 32 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.472" (12.000mm) | 0.126" (3.200mm) | 0.220" (5.600mm) | 0.126" (3.200mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-2X06G00S-3.81-3.81-PPIN HEADER, DOUBLE ROW, 12 PIN, |
2,092 |
|
|
2012 | Bulk | Active | 12 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.150" (3.810mm) | - | 0.150" (3.810mm) | Through Hole | Solder | Gold | Flash | Black |
|
TBSTCM-520-D-125-10-FT-315-P-AP-LF.050 x .050 Header |
1,932 |
|
|
TBSTCM-5-V | Bag | Active | 40 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.382" (9.700mm) | 0.125" (3.175mm) | 0.315" (8.000mm) | - | Surface Mount | Solder | Gold | Flash | Black |
|
2012-2X08G00S-2.9-4.6-22.6BPIN HEADER, DOUBLE ROW, 16 PIN, |
190 |
|
|
2012 | Bulk | Active | 16 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.890" (22.606mm) | 0.181" (4.600mm) | 0.594" (15.100mm) | 0.114" (2.900mm) | Through Hole | Solder | Gold | Flash | Black |
|
2114-2X16G00S3-3-14BPIN HEADER DOUBLE ROW, 32 PINS, |
1,000 |
|
|
2114 | Bulk | Active | 32 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.551" (14.000mm) | 0.118" (3.000mm) | 0.315" (8.000mm) | 0.118" (3.000mm) | Through Hole | Solder | Gold | Flash | Black |
|
HDWM-06-51-G-S-200CONN HDR 6POS 0.05 STACK T/H |
229 |
|
|
Flex Stack, HDWM | Bulk | Active | 6 | 0.050" (1.27mm) | 1 | - | 0.410" (10.414mm) | 0.090" (2.286mm) | 0.200" (5.080mm) | 0.120" (3.048mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
分类概览
电路板间隔柱、堆叠器(板对板) 产品与选型指南
电路板间隔柱、堆叠器(板对板) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 电路板间隔柱、堆叠器(板对板)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 电路板间隔柱、堆叠器(板对板)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
