电路板间隔柱、堆叠器(板对板)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 位置数量 | 间距 | 行数 | 行间距 | 引脚总长度 | 引脚长度 - 配对部分 | 堆叠高度长度 | 引脚尾部长度 | 安装类型 | 端接方式 | 触点表面处理 - 配对部分 | 触点表面处理厚度 - 配对部分 | 颜色 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
829309-8BOARD CONNECTOR, 2 ROW(S), MALE, |
500 |
|
|
AMPMODU Mod II | Tray | Active | 16 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.953" (24.206mm) | 0.228" (5.800mm) | 0.602" (15.300mm) | 0.122" (3.100mm) | Through Hole | Solder | Gold | 30.0µin (0.76µm) | Green |
|
1-827730-0Headers&Wire Housings 10P MOD 2 |
713 |
|
|
AMPMODU Mod II | Bulk | Active | 10 | 0.100" (2.54mm) | 1 | - | 0.953" (24.206mm) | 0.281" (7.150mm) | 0.541" (13.741mm) | 0.130" (3.300mm) | Through Hole | Solder | Gold | Flash | Green |
|
BSTC-240-T-098-12-GT-320-LF.079 Header |
784 |
|
|
BSTC-2 | Bag | Active | 120 | 0.079" (2.00mm) | 3 | 0.079" (2.00mm) | 0.594" (15.088mm) | 0.176" (4.470mm) | 0.320" (8.128mm) | 0.098" (2.489mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-02-07-T-S-200CONN HDR 2POS 0.1 STACK T/H TIN |
509 |
|
|
Flex Stack, DW | Bulk | Active | 2 | 0.100" (2.54mm) | 1 | - | 0.430" (10.922mm) | 0.120" (3.048mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-04-12-T-S-780CONN HDR 4POS 0.1 STACK T/H TIN |
403 |
|
|
Flex Stack, DW | Bulk | Active | 4 | 0.100" (2.54mm) | 1 | - | 1.030" (26.162mm) | 0.140" (3.556mm) | 0.780" (19.812mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-06-08-T-S-300CONN HDR 6POS 0.1 STACK T/H TIN |
847 |
|
|
Flex Stack, DW | Bulk | Active | 6 | 0.100" (2.54mm) | 1 | - | 0.530" (13.462mm) | 0.120" (3.048mm) | 0.300" (7.620mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-10-07-T-S-200CONN HDR 10POS 0.1 STACK T/H TIN |
605 |
|
|
Flex Stack, DW | Bulk | Active | 10 | 0.100" (2.54mm) | 1 | - | 0.430" (10.922mm) | 0.120" (3.048mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
61306428521WR-PHD 2.54 MM DUAL BOARD STACKE |
98 |
|
|
WR-BHD | Bag | Active | 64 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.551" (39.400mm) | 0.236" (6.000mm) | 1.200" (30.480mm) | 0.118" (3.000mm) | Through Hole | Solder | Gold | - | Black |
|
EW-50-12-L-S-500CONN HDR 50POS 0.1 STACK T/H |
19 |
|
|
Flex Stack, EW | Bulk | Active | 50 | 0.100" (2.54mm) | 1 | - | 1.030" (26.162mm) | 0.200" (5.080mm) | 0.500" (12.700mm) | 0.330" (8.382mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
9-146462-0CONN HDR 40POS 0.1 STACK T/H |
80 |
|
|
AMPMODU Mod II | Bulk | Active | 40 | 0.100" (2.54mm) | 1 | - | 0.739" (18.771mm) | 0.330" (8.382mm) | 0.300" (7.620mm) | 0.109" (2.769mm) | Through Hole | Solder | Gold | 15.0µin (0.38µm) | Black |
|
TW-02-02-T-S-200-088CONN HDR 2POS 0.079 STACK T/H |
307 |
|
|
TW | Bulk | Active | 2 | 0.079" (2.00mm) | 1 | - | 0.377" (9.576mm) | 0.089" (2.261mm) | 0.200" (5.080mm) | 0.088" (2.235mm) | Through Hole | Solder | Tin | - | Black |
|
DW-03-10-F-S-375CONN HDR 3POS 0.1 STACK T/H GOLD |
160 |
|
|
Flex Stack, DW | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | 0.830" (21.082mm) | 0.345" (8.763mm) | 0.375" (9.525mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 3.00µin (0.076µm) | Black |
|
DW-02-09-F-D-314CONN HDR 4POS 0.1 STACK T/H GOLD |
847 |
|
|
Flex Stack, DW | Bulk | Active | 4 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.730" (18.542mm) | 0.306" (7.772mm) | 0.314" (7.976mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 3.00µin (0.076µm) | Black |
|
TW-02-04-F-S-320-SMCONN BRD STACK 2MM 2POS |
26 |
|
|
Flex Stack, TW | Bulk | Active | 2 | 0.079" (2.00mm) | 1 | - | 0.487" (12.370mm) | 0.167" (4.242mm) | 0.320" (8.128mm) | - | Surface Mount | Solder | Gold | 3.00µin (0.076µm) | Black |
|
75970-305-06LFCONN HDR 6POS 0.1" STACK T/H |
362 |
|
|
BERGSTIK®, MezzSelect™, Basics+ | Bag | Active | 6 | 0.100" (2.54mm) | 1 | - | 1.025" (26.035mm) | 0.460" (11.684mm) | 0.445" (11.300mm) | 0.120" (3.050mm) | Through Hole | Solder | Tin | 78.7µin (2.00µm) | Black |
|
TW-04-01-T-S-160-080CONN BRD STACK 2.00 4POS |
588 |
|
|
TW | Bulk | Active | 4 | 0.079" (2.00mm) | 1 | - | 0.323" (8.204mm) | 0.083" (2.108mm) | 0.160" (4.064mm) | 0.080" (2.032mm) | Through Hole | Solder | Tin | - | Black |
|
DW-03-10-G-S-610CONN HDR 3POS 0.1 STACK T/H GOLD |
620 |
|
|
Flex Stack, DW | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | 0.830" (21.082mm) | 0.110" (2.794mm) | 0.610" (15.494mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-02-09-G-D-415CONN HDR 4POS 0.1 STACK T/H GOLD |
446 |
|
|
Flex Stack, DW | Bulk | Active | 4 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.730" (18.542mm) | 0.205" (5.207mm) | 0.415" (10.541mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
TW-04-03-T-S-285-100CONN BRD STACK 2.00 4POS |
110 |
|
|
TW | Bulk | Active | 4 | 0.079" (2.00mm) | 1 | - | 0.535" (13.589mm) | 0.150" (3.810mm) | 0.285" (7.239mm) | 0.100" (2.540mm) | Through Hole | Solder | Tin | - | Black |
|
DW-04-07-G-S-200CONN HDR 4POS 0.1 STACK T/H GOLD |
501 |
|
|
Flex Stack, DW | Bulk | Active | 4 | 0.100" (2.54mm) | 1 | - | 0.430" (10.922mm) | 0.120" (3.048mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
分类概览
电路板间隔柱、堆叠器(板对板) 产品与选型指南
电路板间隔柱、堆叠器(板对板) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 电路板间隔柱、堆叠器(板对板)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 电路板间隔柱、堆叠器(板对板)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
