电路板间隔柱、堆叠器(板对板)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 位置数量 | 间距 | 行数 | 行间距 | 引脚总长度 | 引脚长度 - 配对部分 | 堆叠高度长度 | 引脚尾部长度 | 安装类型 | 端接方式 | 触点表面处理 - 配对部分 | 触点表面处理厚度 - 配对部分 | 颜色 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DW-07-07-T-S-200CONN HDR 7POS 0.1 STACK T/H TIN |
550 |
|
|
Flex Stack, DW | Bulk | Active | 7 | 0.100" (2.54mm) | 1 | - | 0.430" (10.922mm) | 0.120" (3.048mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
TW-05-01-T-S-120-100CONN BRD STACK 2.00 5POS |
298 |
|
|
TW | Bulk | Active | 5 | 0.079" (2.00mm) | 1 | - | 0.323" (8.204mm) | 0.103" (2.616mm) | 0.120" (3.048mm) | 0.100" (2.540mm) | Through Hole | Solder | Tin | - | Black |
|
DW-04-09-G-S-200CONN HDR 4POS 0.1 STACK T/H GOLD |
461 |
|
|
Flex Stack, DW | Bulk | Active | 4 | 0.100" (2.54mm) | 1 | - | 0.730" (18.542mm) | 0.420" (10.668mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
HW-03-15-T-D-375-SMCONN HDR 6POS 0.1 STACK SMD TIN |
817 |
|
|
Flex Stack, HW | Bulk | Active | 6 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.565" (14.351mm) | 0.190" (4.826mm) | 0.375" (9.525mm) | - | Surface Mount | Solder | Tin | - | Black |
|
TW-05-03-T-S-285-100CONN BRD STACK 2.00 5POS |
50 |
|
|
TW | Bulk | Active | 5 | 0.079" (2.00mm) | 1 | - | 0.535" (13.589mm) | 0.150" (3.810mm) | 0.285" (7.239mm) | 0.100" (2.540mm) | Through Hole | Solder | Tin | - | Black |
|
DWM-03-51-G-S-200CONN HDR 3POS 0.05 STACK T/H |
57 |
|
|
Flex Stack, DWM | Bulk | Active | 3 | 0.050" (1.27mm) | 1 | - | 0.410" (10.414mm) | 0.090" (2.286mm) | 0.200" (5.080mm) | 0.120" (3.048mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-07-07-L-S-200CONN HDR 7POS 0.1 STACK T/H GOLD |
970 |
|
|
Flex Stack, DW | Bulk | Active | 7 | 0.100" (2.54mm) | 1 | - | 0.430" (10.922mm) | 0.120" (3.048mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
EW-04-11-G-S-400CONN HDR 4POS 0.1 STACK T/H GOLD |
833 |
|
|
Flex Stack, EW | Bulk | Active | 4 | 0.100" (2.54mm) | 1 | - | 0.930" (23.622mm) | 0.200" (5.080mm) | 0.400" (10.160mm) | 0.330" (8.382mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
HW-03-16-G-S-250-SMCONN HDR 3POS 0.1 STACK SMD GOLD |
686 |
|
|
Flex Stack, HW | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | 0.380" (9.650mm) | 0.130" (3.302mm) | 0.250" (6.350mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-05-09-T-D-500CONN HDR 10POS 0.1 STACK T/H TIN |
69 |
|
|
Flex Stack, DW | Bulk | Active | 10 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.730" (18.542mm) | 0.120" (3.048mm) | 0.500" (12.700mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
ZW-02-19-G-D-472-429CONN BRD STACK .100" 4POS |
25 |
|
|
Flex Stack, ZW | Bulk | Active | 4 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.330" (33.782mm) | 0.429" (10.900mm) | 0.472" (11.989mm) | 0.429" (10.900mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-04-13-F-D-935CONN HDR 8POS 0.1 STACK T/H GOLD |
57 |
|
|
Flex Stack, DW | Bulk | Active | 8 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.230" (31.242mm) | 0.185" (4.699mm) | 0.935" (23.749mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 3.00µin (0.076µm) | Black |
|
TW-03-03-L-D-180-126CONN HDR 6POS 0.079 STACK T/H |
17 |
|
|
TW | Bulk | Active | 6 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.535" (13.589mm) | 0.229" (5.817mm) | 0.180" (4.572mm) | 0.126" (3.200mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-16-08-T-S-250CONN HDR 16POS 0.1 STACK T/H TIN |
50 |
|
|
Flex Stack, DW | Bulk | Active | 16 | 0.100" (2.54mm) | 1 | - | 0.530" (13.462mm) | 0.170" (4.318mm) | 0.250" (6.350mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-10-08-G-S-216CONN BRD STACK .100" 10POS |
26 |
|
|
Flex Stack, DW | Bulk | Active | 10 | 0.100" (2.54mm) | 1 | - | 0.530" (13.462mm) | 0.204" (5.182mm) | 0.216" (5.486mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
ZW-05-09-L-D-443-190CONN HDR 10POS 0.1 STACK T/H |
61 |
|
|
Flex Stack, ZW | Bulk | Active | 10 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.730" (18.542mm) | 0.097" (2.464mm) | 0.443" (11.252mm) | 0.190" (4.826mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
TW-07-08-F-S-530-100CONN BRD STACK 2MM 7POS |
40 |
|
|
TW | Bulk | Active | 7 | 0.079" (2.00mm) | 1 | - | 0.831" (21.107mm) | 0.201" (5.100mm) | 0.530" (13.462mm) | 0.100" (2.540mm) | Through Hole | Solder | Gold | 3.00µin (0.076µm) | Black |
|
DW-08-13-T-D-750CONN HDR 16POS 0.1 STACK T/H TIN |
47 |
|
|
Flex Stack, DW | Bulk | Active | 16 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.230" (31.242mm) | 0.370" (9.400mm) | 0.750" (19.050mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
ZW-06-14-L-D-1103-090CONN BRD STACK .100" 12POS |
39 |
|
|
Flex Stack, ZW | Bulk | Active | 12 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.430" (36.322mm) | 0.237" (6.020mm) | 1.103" (28.016mm) | 0.090" (2.286mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
HW-04-15-G-D-315-SM-ACONN HDR 8POS 0.1 STACK SMD GOLD |
79 |
|
|
Flex Stack, HW | Bulk | Active | 8 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.565" (14.351mm) | 0.250" (6.350mm) | 0.315" (8.000mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
分类概览
电路板间隔柱、堆叠器(板对板) 产品与选型指南
电路板间隔柱、堆叠器(板对板) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 电路板间隔柱、堆叠器(板对板)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 电路板间隔柱、堆叠器(板对板)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
