电路板间隔柱、堆叠器(板对板)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 位置数量 | 间距 | 行数 | 行间距 | 引脚总长度 | 引脚长度 - 配对部分 | 堆叠高度长度 | 引脚尾部长度 | 安装类型 | 端接方式 | 触点表面处理 - 配对部分 | 触点表面处理厚度 - 配对部分 | 颜色 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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M55302/62-A24HMIL-DTL-55302 Series Connector |
13 |
|
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* | Retail Package | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
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WTA50SACJTStraight Cable and Plated Thru H |
22 |
|
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* | Retail Package | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
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M55302/55-A24LMIL-DTL-55302 Series Connector |
11 |
|
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* | Retail Package | Active | - | - | - | - | - | - | - | - | - | - | - | - | - |
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BSTCM-105-D-230-16-GT-285-LF.100 Header |
200 |
|
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BSTCM-1 | Bag | Active | 10 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.565" (14.351mm) | 0.230" (5.842mm) | 0.285" (7.239mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
BSTC-106-D-110-24-GT-500-LF.100 Header |
425 |
|
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BSTC-1 | Bag | Active | 12 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.930" (23.622mm) | 0.320" (8.128mm) | 0.500" (12.700mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
BSTCM-116-D-230-20-GT-400-LF.100 Header |
30 |
|
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BSTCM-1 | Bag | Active | 32 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.665" (16.891mm) | 0.230" (5.842mm) | 0.400" (10.160mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
2-829587-0MOD-2 PIN HDR.2X20P |
40 |
|
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AMPMODU Mod II | Bulk | Active | 40 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.087" (27.600mm) | 0.232" (5.900mm) | 0.728" (18.500mm) | 0.126" (3.200mm) | Through Hole | Solder | Gold | 3.94 µin (0.1 µm) | Green |
|
DW-02-15-G-S-360CONN HDR 2POS 0.1 STACK T/H GOLD |
84 |
|
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Flex Stack, DW | Bulk | Active | 2 | 0.100" (2.54mm) | 1 | - | 0.630" (16.002mm) | 0.160" (4.064mm) | 0.360" (9.144mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-05-13-F-D-935CONN HDR 10POS 0.1 STACK T/H |
6 |
|
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Flex Stack, DW | Bulk | Active | 10 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.230" (31.242mm) | 0.185" (4.699mm) | 0.935" (23.749mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 3.00µin (0.076µm) | Black |
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FW-04-04-F-D-200-075CONN HDR 8POS 0.05 STACK T/H |
1 |
|
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Flex Stack, FW | Bulk | Active | 8 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.365" (9.271mm) | 0.075" (1.905mm) | 0.200" (5.080mm) | 0.090" (2.286mm) | Through Hole | Solder | Gold | 3.00µin (0.076µm) | Black |
|
DW-10-11-F-D-500CONN HDR 20POS 0.1 STACK T/H |
6 |
|
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Flex Stack, DW | Bulk | Active | 20 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.930" (23.622mm) | 0.320" (8.128mm) | 0.500" (12.700mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 3.00µin (0.076µm) | Black |
|
HW-07-10-F-D-510-SM-ACONN HDR 14POS 0.1 STACK SMD |
18 |
|
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Flex Stack, HW | Tube | Active | 14 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.765" (19.431mm) | 0.255" (6.477mm) | 0.510" (12.954mm) | - | Surface Mount | Solder | Gold | 3.00µin (0.076µm) | Black |
|
TW-08-03-L-D-250-120CONN HDR 16POS 0.079 STACK T/H |
19 |
|
|
TW | Bulk | Active | 16 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.535" (13.589mm) | 0.165" (4.191mm) | 0.250" (6.350mm) | 0.120" (3.048mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
HW-09-08-L-D-285-SM-ACONN HDR 18POS 0.1 STACK SMD |
23 |
|
|
Flex Stack, HW | Tube | Active | 18 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.465" (11.811mm) | 0.180" (4.572mm) | 0.285" (7.239mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
TW-10-08-L-D-510-105CONN BRD STACK 2MM 20POS |
8 |
|
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TW | Bulk | Active | 20 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.831" (21.107mm) | 0.216" (5.486mm) | 0.510" (12.954mm) | 0.105" (2.667mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
TW-13-06-G-S-170-SM2.00 MM FLEX STACK, FLEXIBLE BOA |
17 |
|
|
Flex Stack, TW | Tube | Active | 13 | 0.079" (2.00mm) | 1 | - | 0.605" (15.367mm) | 0.435" (11.049mm) | 0.170" (4.318mm) | - | Surface Mount | Solder | Gold | 20.0µin (0.51µm) | Black |
|
FW-25-04-F-D-446-150CONN HDR 50POS 0.05 STACK T/H |
24 |
|
|
Flex Stack, FW | Tube | Active | 50 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.686" (17.424mm) | 0.150" (3.810mm) | 0.446" (11.328mm) | 0.090" (2.286mm) | Through Hole | Solder | Gold | 3.00µin (0.076µm) | Black |
|
FW-20-05-L-D-535-075CONN HDR 40POS 0.05 STACK SMD |
24 |
|
|
Flex Stack, FW | Tube | Active | 40 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.610" (15.494mm) | 0.075" (1.905mm) | 0.535" (13.589mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
FW-25-04-L-D-200-120CONN HDR 50POS 0.05 STACK T/H |
14 |
|
|
Flex Stack, FW | Tube | Active | 50 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.410" (10.414mm) | 0.120" (3.048mm) | 0.200" (5.080mm) | 0.090" (2.286mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
FW-20-05-G-D-254-150CONN HDR 40POS 0.05 STACK SMD |
18 |
|
|
Flex Stack, FW | Tube | Active | 40 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.404" (10.262mm) | 0.150" (3.810mm) | 0.254" (6.452mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
分类概览
电路板间隔柱、堆叠器(板对板) 产品与选型指南
电路板间隔柱、堆叠器(板对板) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 电路板间隔柱、堆叠器(板对板)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 电路板间隔柱、堆叠器(板对板)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
