电路板间隔柱、堆叠器(板对板)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 位置数量 | 间距 | 行数 | 行间距 | 引脚总长度 | 引脚长度 - 配对部分 | 堆叠高度长度 | 引脚尾部长度 | 安装类型 | 端接方式 | 触点表面处理 - 配对部分 | 触点表面处理厚度 - 配对部分 | 颜色 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2012-1X01G00S/2.8/2.3/EPIN HEADER, SINGLE ROW, 1 PIN, S |
903 |
|
|
2012 | Bulk | Active | 1 | 0.100" (2.54mm) | 1 | - | - | 0.091" (2.300mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
2012-1X01G00S/028/031/KPIN HEADER, SINGLE ROW, 1 PIN, S |
510 |
|
|
2012 | Bulk | Active | 1 | 0.100" (2.54mm) | 1 | - | - | 0.122" (3.100mm) | - | 0.110" (2.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
2114-2X03G00S-3.2-3.2-12BPIN HEADER, DOUBLE ROW, 6 PIN, S |
970 |
|
|
2114 | Bulk | Active | 6 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.472" (12.000mm) | 0.126" (3.200mm) | 0.220" (5.600mm) | 0.126" (3.200mm) | Through Hole | Solder | Gold | Flash | Black |
|
DW-02-07-T-D-240CONN HDR 4POS 0.1 STACK T/H TIN |
10 |
|
|
Flex Stack, DW | Bulk | Active | 4 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.430" (10.922mm) | 0.080" (2.032mm) | 0.240" (6.096mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-04-08-T-S-250CONN HDR 4POS 0.1 STACK T/H TIN |
25 |
|
|
Flex Stack, DW | Bulk | Active | 4 | 0.100" (2.54mm) | 1 | - | 0.530" (13.462mm) | 0.170" (4.318mm) | 0.250" (6.350mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-05-07-T-S-240CONN HDR 5POS 0.1 STACK T/H TIN |
300 |
|
|
Flex Stack, DW | Bulk | Active | 5 | 0.100" (2.54mm) | 1 | - | 0.430" (10.922mm) | 0.080" (2.032mm) | 0.240" (6.096mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
ZW-04-11-T-S-640-090-LLCONN BRD STACK .100" 4POS |
117 |
|
|
Flex Stack, ZW | Bulk | Active | 4 | 0.100" (2.54mm) | 1 | - | 0.930" (23.622mm) | 0.200" (5.080mm) | 0.640" (16.256mm) | 0.090" (2.286mm) | Through Hole | Kinked Pin, Solder | Tin | - | Black |
|
DW-03-12-T-S-370-002FLEXIBLE BOARD STACKING HEADER W |
90 |
|
|
Flex Stack, DW | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | 1.030" (26.162mm) | 0.550" (13.970mm) | 0.370" (9.400mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
BSTCM-706-D-180-11-F-125-TR-P-LF.039 Header |
139 |
|
|
BSTCM-7 | Bag | Active | 12 | 0.039" (1.00mm) | 2 | 0.039" (1.00mm) | 0.310" (7.874mm) | 0.180" (4.572mm) | 0.125" (3.175mm) | - | Surface Mount | Solder | Gold | Flash | Black |
|
EW-03-14-T-D-873FLEXIBLE BOARD STACKING HEADER W |
66 |
|
|
Flex Stack, EW | Bulk | Active | 6 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.430" (36.322mm) | 0.227" (5.766mm) | 0.873" (22.174mm) | 0.330" (8.382mm) | Through Hole | Solder | Tin | - | Black |
|
BSTCR-110-D-090-20-GT-210-LF.100 Header |
150 |
|
|
BSTCR-1 | Bag | Active | 20 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.290" (7.366mm) | 0.210" (5.334mm) | 0.090" (2.286mm) | Through Hole, Right Angle | Solder | Gold | 10.0µin (0.25µm) | Black |
|
ZW-05-17-G-S-300-090CONN BRD STACK .100" 5POS |
2 |
|
|
Flex Stack, ZW | Bulk | Active | 5 | 0.100" (2.54mm) | 1 | - | 0.480" (12.192mm) | 0.090" (2.286mm) | 0.300" (7.620mm) | 0.090" (2.286mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-16-07-T-S-300CONN BRD STACK .100" 16POS |
30 |
|
|
Flex Stack, DW | Bulk | Active | 16 | 0.100" (2.54mm) | 1 | - | 0.430" (10.922mm) | 0.020" (0.508mm) | 0.300" (7.620mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
2012-2X10G00S-5.08-5.08-KPIN HEADER, DOUBLE ROW, 20 PIN, |
36 |
|
|
2012 | Bulk | Active | 20 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | - | 0.200" (5.080mm) | - | 0.200" (5.080mm) | Through Hole | Solder | Gold | Flash | Black |
|
TW-04-02-L-D-170-100CONN BRD STACK 2.00 8POS |
9 |
|
|
TW | Bulk | Active | 8 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.377" (9.576mm) | 0.107" (2.718mm) | 0.170" (4.318mm) | 0.100" (2.540mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
ZW-09-10-G-S-357-220CONN BRD STACK .100" 9POS |
3 |
|
|
Flex Stack, ZW | Bulk | Active | 9 | 0.100" (2.54mm) | 1 | - | 0.830" (21.082mm) | 0.253" (6.426mm) | 0.357" (9.068mm) | 0.220" (5.588mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
2114-2X20G00S/3.8/4.6/21.1BPIN HEADER, DOUBLE ROW, 40 PIN, |
51 |
|
|
2114 | Bulk | Active | 40 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.831" (21.100mm) | 0.181" (4.600mm) | 0.500" (12.700mm) | 0.150" (3.800mm) | Through Hole | Solder | Gold | Flash | Black |
|
TW-02-07-L-D-525-SMCONN HEADER 2MM 4POS GOLD |
97 |
|
|
Flex Stack, TW | Bulk | Active | 4 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.751" (19.075mm) | 0.158" (4.013mm) | 0.525" (13.335mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
FW-05-03-FM-D-260-065-PCONN HDR 10POS 0.05 STACK SMD |
87 |
|
|
Flex Stack, FW | Tube | Active | 10 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.325" (8.255mm) | 0.065" (1.651mm) | 0.260" (6.604mm) | - | Surface Mount | Solder | Gold | 3.00µin (0.076µm) | Black |
|
TW-06-03-G-D-215-190CONN BRD STACK 2.00 12POS |
43 |
|
|
TW | Bulk | Active | 12 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.535" (13.589mm) | 0.130" (3.302mm) | 0.215" (5.461mm) | 0.190" (4.826mm) | Through Hole | Solder | Gold | 20.0µin (0.51µm) | Black |
分类概览
电路板间隔柱、堆叠器(板对板) 产品与选型指南
电路板间隔柱、堆叠器(板对板) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 电路板间隔柱、堆叠器(板对板)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 电路板间隔柱、堆叠器(板对板)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
