电路板间隔柱、堆叠器(板对板)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 位置数量 | 间距 | 行数 | 行间距 | 引脚总长度 | 引脚长度 - 配对部分 | 堆叠高度长度 | 引脚尾部长度 | 安装类型 | 端接方式 | 触点表面处理 - 配对部分 | 触点表面处理厚度 - 配对部分 | 颜色 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DW-03-09-T-S-500CONN HDR 3POS 0.1 STACK T/H TIN |
470 |
|
|
Flex Stack, DW | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | 0.730" (18.542mm) | 0.120" (3.048mm) | 0.500" (12.700mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-02-15-G-S-200CONN HDR 2POS 0.1 STACK T/H GOLD |
225 |
|
|
Flex Stack, DW | Bulk | Active | 2 | 0.100" (2.54mm) | 1 | - | 0.630" (16.002mm) | 0.320" (8.128mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
HW-02-08-T-D-250-SMCONN HDR 4POS 0.1 STACK SMD TIN |
900 |
|
|
Flex Stack, HW | Bulk | Active | 4 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.465" (11.811mm) | 0.215" (5.461mm) | 0.250" (6.350mm) | - | Surface Mount | Solder | Tin | - | Black |
|
DW-03-07-G-S-200CONN HDR 3POS 0.1 STACK T/H GOLD |
131 |
|
|
Flex Stack, DW | Bulk | Active | 3 | 0.100" (2.54mm) | 1 | - | 0.430" (10.922mm) | 0.120" (3.048mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-03-07-T-D-200CONN HDR 6POS 0.1 STACK T/H TIN |
64 |
|
|
Flex Stack, DW | Bulk | Active | 6 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.430" (10.922mm) | 0.120" (3.048mm) | 0.200" (5.080mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-08-08-T-S-315CONN HDR 8POS 0.1 STACK T/H TIN |
95 |
|
|
Flex Stack, DW | Bulk | Active | 8 | 0.100" (2.54mm) | 1 | - | 0.530" (13.462mm) | 0.105" (2.667mm) | 0.315" (8.000mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-08-09-T-S-500CONN HDR 8POS 0.1 STACK T/H TIN |
38 |
|
|
Flex Stack, DW | Bulk | Active | 8 | 0.100" (2.54mm) | 1 | - | 0.730" (18.542mm) | 0.120" (3.048mm) | 0.500" (12.700mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-10-08-T-S-270CONN BRD STACK .100" 10POS |
172 |
|
|
Flex Stack, DW | Bulk | Active | 10 | 0.100" (2.54mm) | 1 | - | 0.530" (13.462mm) | 0.150" (3.800mm) | 0.270" (6.858mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DW-05-15-T-D-250CONN HDR 10POS 0.1 STACK T/H TIN |
100 |
|
|
Flex Stack, DW | Bulk | Active | 10 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.630" (16.002mm) | 0.270" (6.858mm) | 0.250" (6.350mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
DWM-05-51-G-S-200CONN HDR 5POS 0.05 STACK T/H |
47 |
|
|
Flex Stack, DWM | Bulk | Active | 5 | 0.050" (1.27mm) | 1 | - | 0.410" (10.414mm) | 0.090" (2.286mm) | 0.200" (5.080mm) | 0.120" (3.048mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
TW-03-04-L-D-355-080CONN BRD STACK 2.00 6POS |
20 |
|
|
TW | Bulk | Active | 6 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.555" (14.097mm) | 0.120" (3.048mm) | 0.355" (9.017mm) | 0.080" (2.032mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
DW-07-10-T-D-550CONN HDR 14POS 0.1 STACK T/H TIN |
79 |
|
|
Flex Stack, DW | Bulk | Active | 14 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.830" (21.082mm) | 0.170" (4.318mm) | 0.550" (13.970mm) | 0.110" (2.794mm) | Through Hole | Solder | Tin | - | Black |
|
HW-05-08-F-D-250-SMCONN HDR 10POS 0.1 STACK SMD |
26 |
|
|
Flex Stack, HW | Tube | Active | 10 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 0.465" (11.811mm) | 0.215" (5.461mm) | 0.250" (6.350mm) | - | Surface Mount | Solder | Gold | 3.00µin (0.076µm) | Black |
|
FW-03-03-L-D-225-065CONN HDR 6POS 0.05 STACK SMD |
42 |
|
|
Flex Stack, FW | Bulk | Active | 6 | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | 0.290" (7.366mm) | 0.065" (1.651mm) | 0.225" (5.715mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
HW-07-09-G-S-410-SMCONN BRD STACK .100" 7POS |
30 |
|
|
Flex Stack, HW | Bulk | Active | 7 | 0.100" (2.54mm) | 1 | - | 0.665" (16.891mm) | 0.255" (6.477mm) | 0.410" (10.414mm) | - | Surface Mount | Solder | Gold | 10.0µin (0.25µm) | Black |
|
HW-05-14-G-D-834-366HIGH TEMPERATURE FLEXIBLE BOARD |
81 |
|
|
Flex Stack, HW | Bulk | Active | 10 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.430" (36.322mm) | 0.230" (5.842mm) | 0.834" (21.184mm) | 0.366" (9.296mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black, Natural |
|
DWM-06-61-G-S-745CONN HDR 6POS 0.05 STACK T/H |
86 |
|
|
Flex Stack, DWM | Bulk | Active | 6 | 0.050" (1.27mm) | 1 | - | 1.050" (26.670mm) | 0.185" (4.699mm) | 0.745" (18.923mm) | 0.120" (3.048mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
TW-06-04-L-D-250-116CONN BRD STACK 2.00 12POS |
20 |
|
|
TW | Bulk | Active | 12 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 0.555" (14.097mm) | 0.189" (4.800mm) | 0.250" (6.350mm) | 0.116" (2.946mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
ZW-07-20-G-D-338-396CONN BRD STACK .100" 14POS |
6 |
|
|
Flex Stack, ZW | Bulk | Active | 14 | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | 1.130" (28.702mm) | 0.396" (10.058mm) | 0.338" (8.585mm) | 0.396" (10.058mm) | Through Hole | Solder | Gold | 10.0µin (0.25µm) | Black |
|
TW-05-12-G-D-531-289CONN BRD STACK 2.00 10POS |
4 |
|
|
TW | Bulk | Active | 10 | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | 1.110" (28.194mm) | 0.290" (7.366mm) | 0.531" (13.500mm) | 0.289" (7.341mm) | Through Hole | Solder | Gold | 20.0µin (0.51µm) | Black |
分类概览
电路板间隔柱、堆叠器(板对板) 产品与选型指南
电路板间隔柱、堆叠器(板对板) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 电路板间隔柱、堆叠器(板对板)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 电路板间隔柱、堆叠器(板对板)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
