系统级芯片(SoC)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MPFS250T-FCVG784IIC SOC RISC-V 784FCBGA |
2 |
|
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PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 784-FCBGA (23x23) |
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MPFS250T-FCSG536IIC SOC RISC-V 536LFBGA |
4 |
|
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PolarFire® | 536-LFBGA, CSPBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 536-LFBGA |
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M2S150T-FCG1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
3 |
|
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SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
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MPFS250T-1FCG1152EIC SOC RISC-V 1152FCBGA |
4 |
|
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PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 1152-FCBGA (35x35) |
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XCZU2EG-2UBVA530IIC SOC CORTEX-A53 530BGA |
5 |
|
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- | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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XCZU3EG-1UBVA530EIC SOC CORTEX-A53 530BGA |
4 |
|
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- | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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MPFS250T-1FCG1152IIC SOC RISC-V 1152FCBGA |
5 |
|
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PolarFire® | 1152-BBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 1152-FCBGA (35x35) |
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5CSTFD6D5F31I7NIC SOC CORTEX-A9 800MHZ 896FBGA |
19 |
|
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Cyclone® V ST | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 110K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 896-FBGA (31x31) |
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XCZU2EG-2SFVC784IIC SOC CORTEX-A53 784FCBGA |
20 |
|
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Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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MPFS250TS-FCSG536IIC SOC RISC-V 536LFBGA |
4 |
|
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PolarFire® | 536-LFBGA, CSPBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 536-LFBGA |
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SOM-2532DCBC-U0A1SBC 2.0GHZ 4 CORE 0GB/16GB RAM |
3 |
|
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SMARC | Module | Bulk | Active | MPU | Intel® Atom® x6425E | - | 16GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 2GHz | - | 0°C ~ 60°C | - | - | - |
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MPFS250TLS-FCVG784IIC SOC RISC-V 784FCBGA |
11 |
|
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PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 784-FCBGA (23x23) |
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XCZU3EG-1UBVA530IIC SOC CORTEX-A53 530BGA |
6 |
|
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- | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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MPFS250TLS-FCSG536IIC SOC RISC-V 536LFBGA |
2 |
|
|
PolarFire® | 536-LFBGA, CSPBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | -40°C ~ 100°C | - | - | 536-LFBGA |
|
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XCZU3CG-2UBVA530IIC SOC CORTEX-A53 530BGA |
12 |
|
|
- | 530-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 530-FCBGA (16x9.5) |
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XAZU3EG-1SFVC784IIC SOC CORTEX-A53 784FCBGA |
7 |
|
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Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.8MB | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
XCZU4EG-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
22 |
|
|
Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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XCZU4EV-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
15 |
|
|
Zynq® UltraScale+™ MPSoC EV | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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XCZU4CG-1FBVB900EIC SOC CORTEX-A53 900FCBGA |
5 |
|
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Zynq® UltraScale+™ MPSoC CG | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
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10AS027E3F29I2SGIC SOC CORTEX-A9 1.5GHZ 780FBGA |
4 |
|
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Arria 10 SX | 780-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 270K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 780-FBGA, FC (29x29) |
分类概览
系统级芯片(SoC) 产品与选型指南
系统级芯片(SoC) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 系统级芯片(SoC)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 系统级芯片(SoC)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
