系统级芯片(SoC)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XC7Z035-2FFG900IIC SOC CORTEX-A9 800MHZ 900FCBGA |
4 |
|
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Zynq®-7000 | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 275K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
XCZU9EG-1FFVC900EIC SOC CORTEX-A53 900FCBGA |
3 |
|
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Zynq® UltraScale+™ MPSoC EG | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
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XCVM1302-2HSINBVB1024IC VERSALPRIME ACAP FPGA 1024BGA |
3 |
|
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Versal™ Prime | 1024-BFBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz, 1.4GHz | Versal™ Prime FPGA, 70k Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1024-BGA (31x31) |
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SC-13048Q-ASITCORE SC13048Q SOC |
82 |
|
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- | 48-QFN | Tray | Active | MPU | - | 220kB | 128kB | PWM | CAN, GPIO, I2C, SPI, UART/USART | 80MHz | - | -40°C ~ 85°C | - | - | 48-QFN (7x7) |
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M2S005-TQG144IC SOC CORTEX-M3 166MHZ 144TQFP |
58 |
|
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SmartFusion®2 | 144-LQFP | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 144-TQFP (20x20) |
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M2S005-TQG144IIC SOC CORTEX-M3 166MHZ 144TQFP |
48 |
|
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SmartFusion®2 | 144-LQFP | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | - | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 144-TQFP (20x20) |
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M2S005-VFG400IC SOC CORTEX-M3 166MHZ 400VFBGA |
46 |
|
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SmartFusion®2 | 400-LFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 400-VFBGA (17x17) |
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M2S005-FGG484IC SOC CORTEX-M3 166MHZ 484FBGA |
60 |
|
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SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 128KB | 64KB | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 5K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FPBGA (23x23) |
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M2S010-VFG400IIC SOC CORTEX-M3 166MHZ 400VFBGA |
33 |
|
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SmartFusion®2 | 400-LFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 400-VFBGA (17x17) |
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30SOC-SC-539IC SOC CORTEX-M4 84MHZ 64LQFP |
10 |
|
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G30 .NET | 64-LQFP | Bulk | Not For New Designs | MPU | ARM® Cortex®-M4 | 128KB | 68KB | PWM | I2C, SPI, UART/USART | 84MHz | - | -40°C ~ 85°C | - | - | 64-LQFP (10x10) |
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M2S010T-FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
13 |
|
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SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 10K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 484-FPBGA (23x23) |
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5CSXFC5D6F31C8NIC SOC CORTEX-A9 600MHZ 896FBGA |
20 |
|
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Cyclone® V SX | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
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5CSEMA6F31C8NIC SOC CORTEX-A9 600MHZ 896FBGA |
5 |
|
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Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
|
5CSXFC6D6F31C8NIC SOC CORTEX-A9 600MHZ 896FBGA |
17 |
|
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Cyclone® V SX | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 600MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 896-FBGA (31x31) |
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5CSXFC5D6F31I7NIC SOC CORTEX-A9 800MHZ 896FBGA |
17 |
|
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Cyclone® V SX | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 896-FBGA (31x31) |
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XCZU1CG-2SBVA484IIC ZUP MPSOC CG A53 FPGA 484BGA |
24 |
|
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Zynq® UltraScale+™ MPSoC CG | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
|
XAZU1EG-1SFVC784IIC ZUP MPSOC A53 FPGA Q 784BGA |
5 |
|
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Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 82K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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XCZU1CG-2SFVC784IIC ZUP MPSOC CG A53 FPGA 784BGA |
10 |
|
|
Zynq® UltraScale+™ MPSoC CG | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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MPFS250T-1FCVG784EIC SOC RISC-V 784FCBGA |
2 |
|
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PolarFire® | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 2.2MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 254K Logic Modules | 0°C ~ 100°C | - | - | 784-FCBGA (23x23) |
|
XCZU1EG-2SBVA484IIC ZUP MPSOC EG A53 FPGA 484BGA |
24 |
|
|
Zynq® UltraScale+™ MPSoC EG | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 533MHz, 600MHz, 1.333GHz | - | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
分类概览
系统级芯片(SoC) 产品与选型指南
系统级芯片(SoC) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 系统级芯片(SoC)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 系统级芯片(SoC)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
