系统级芯片(SoC)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PLCHIP-P10-51220P10 PLC ON A CHIP, LQFP-144, UP |
120 |
|
|
- | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
PSB21653EV1.4-GINCA -IP2 SINGLE-CHIP IP PHONE W |
429 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
R8J66744BG#R0SOC/SIP |
909 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
SC1201UFH-266SC1201 - 32-BIT MICROPROCESSOR |
18,109 |
|
|
- | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
PLCHIP-P13-51220P13 PLC ON A CHIP LQFP-208, UP T |
36 |
|
|
- | 208-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 208-LQFP (28x28) |
|
R8J66607B00FP#RF1SSOC/SIP |
2,826 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
SC1201UFH-266BSC1201 - 32-BIT MICROPROCESSOR |
37 |
|
|
- | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
SC1200UFH-266SC1200 - 32-BIT MICROPROCESSOR |
348 |
|
|
- | 481-BFBGA | Bulk | Active | MPU | X86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 266MHz | - | 0°C ~ 85°C (TC) | - | - | 481-BGA (40x40) |
|
SC2200UCL-300MICRO PERIPHERAL IC PBGA432 |
7,946 |
|
|
Geode™ | 432-BGA Exposed Pad | Bulk | Active | MPU | x86 | - | - | AC97/AMC97, DMA, PCI, SmartCard, WDT | Access.bus, GPIO, PC/AT, UART | 300MHz | - | 0°C ~ 85°C (TC) | - | - | 432-EBGA (40x40) |
|
TDA4AL88TGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP FOR |
210 |
|
|
- | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
DRA829JMTGBALFRDUAL ARM CORTEX-A72, QUAD CORTEX |
250 |
|
|
- | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | - | - | 827-FCBGA (24x24) |
|
TDA4VE88TGAALZRQ1AUTOMOTIVE SYSTEM-ON-A-CHIP FOR |
175 |
|
|
- | 770-BFBGA, FCBGA | Tape & Reel (TR) | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 2MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 770-FCBGA (23x23) |
|
TDA4VM88TGBALFRNEXT GENERATION SOC FAMILY FOR L |
494 |
|
|
- | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
PXB4340EV1.1-GAOP ATM OAM PROCESSOR |
360 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
TDA4VM88TGBALFRQ1NEXT GENERATION SOC FAMILY FOR L |
218 |
|
|
- | 827-BFBGA, FCBGA | Tape & Reel (TR) | Last Time Buy | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 827-FCBGA (24x24) |
|
M2S050T-FGG484IC SOC CORTEX-M3 166MHZ 484FBGA |
60 |
|
|
SmartFusion®2 | 484-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FPBGA (23x23) |
|
WDC6202GJL250XWIRELESS 27MM 6202 WITH XBUS |
80 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
PXB4330EV2.1AOP ATM OAM PROCESSOR |
246 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
5CSEBA5U19I7NIC SOC CORTEX-A9 800MHZ 484UBGA |
79 |
|
|
Cyclone® V SE | 484-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | FPGA - 85K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 484-UBGA (19x19) |
|
5CSEBA6U23C6NIC SOC CORTEX-A9 925MHZ 672UBGA |
60 |
|
|
Cyclone® V SE | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
分类概览
系统级芯片(SoC) 产品与选型指南
系统级芯片(SoC) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 系统级芯片(SoC)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 系统级芯片(SoC)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
