微控制器、微处理器、FPGA 模块
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 模块/板类型 | 核心处理器 | 协处理器 | 速度 | 闪存大小 | RAM 大小 | 连接器类型 | 尺寸 / 尺寸 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0803-04-5DE11-AIC MODULE ZYNQ USCALE 2GB 128MB |
0 |
|
|
TE0803 | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
TE0813-01-5DE11-AMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
|
|
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0817-01-4AI21-AMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
|
|
Zynq® UltraScale+™ | Bulk | Obsolete | MPU Core | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | -40°C ~ 85°C |
|
TE0813-02-5DE81-AMPSOC MODULE WITH AMD ZYNQ ULTRA |
0 |
|
|
Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-05-9BE81-LULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
TE0808 | Bulk | Active | MPU Core | - | - | - | 128MB | 4GB | - | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - |
|
TE0808-05-9BE21-LULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
TE0808 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-05-9BE21-FULTRASOM+ MPSOC MODULE WITH AMD |
0 |
|
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0818-01-9BE21-AULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
AM0010-02-5DE21MAMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
|
|
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ ZU5EV-1E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.220" L x 1.575" W (56.40mm x 40.00mm) | 0°C ~ 85°C |
|
TE0808-05-9BE81-AULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
TE0808 | Bulk | Discontinued at Digi-Key | MPU Core | - | - | - | 128MB | 4GB | - | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - |
|
TE0808-05-9BE21-EULTRASOM+ MPSOC MODULE WITH AMD |
0 |
|
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0807-03-4AI21-AMPSOC ZYNQ USCALE 4GB DDR4 |
0 |
|
|
TE0807 | Box | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0808-04-9BE21-LIC MOD SOM MPSOC 4GB XCZU9EG |
0 |
|
|
TE0808 | Box | Active | MPU Core | - | - | - | 128MB | 4GB | B2B | - | - |
|
TE0808-05-9BE21-LZULTRASOM+ MPSOC MODULE WITH AMD |
0 |
|
|
Zynq UltraScale+ | Bulk | Obsolete | MPU Core | Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0818-02-9BE81-AULTRASOM+ MPSOC MODULE WITH AMD |
0 |
|
|
Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-05-9BE81-AKULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
- | Bulk | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - |
|
ME-AA1-480-2I3-D12E-NFX3-R2SOM ARRIA 10 10AS048 4GB |
0 |
|
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0807-03-7DI21-AMPSOC ZYNQ USCALE 4GB DDR4 |
0 |
|
|
TE0807 | Box | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0741-05-G2C-1-AMODULE FPGA KINTEX |
0 |
|
|
Kintex™-7 | Bulk | Active | FPGA | Xilinx Kintex-7 FPGA XC7K410T-2FBG676C | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 70°C |
|
TE0841-02-31C21-AIC MODULE |
0 |
|
|
TE0841 | Bulk | Discontinued at Digi-Key | FPGA Core | Kintex UltraScale KU035 | - | - | 64MB | 2GB | B2B | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 70°C |
分类概览
微控制器、微处理器、FPGA 模块 产品与选型指南
微控制器、微处理器、FPGA 模块 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 微控制器、微处理器、FPGA 模块。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 微控制器、微处理器、FPGA 模块?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
