微控制器、微处理器、FPGA 模块
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 模块/板类型 | 核心处理器 | 协处理器 | 速度 | 闪存大小 | RAM 大小 | 连接器类型 | 尺寸 / 尺寸 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TE0745-02-91C31-AMOD SOM DDR3L 1GB |
0 |
|
|
TE0745 | Bulk | Obsolete | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7045) | - | 64MB | 1GB | Board-to-Board (BTB) Socket - 480 | 2.050" L x 2.990" W (52.00mm x 76.00mm) | -40°C ~ 85°C |
|
TE0817-01-4BE21-AMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
|
|
Zynq® UltraScale+™ | Bulk | Obsolete | MPU Core | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
IW-G30M-C4CG-4E002G-E008G-BIAZU4CG (-1 Speed) MPSoC SOM |
1 |
|
|
Zynq® UltraScale+™ | Bulk | Active | MPU, FPG | ARM® Cortex®-A53(x40, ARM® Cortex®-R5(x2) | ARM® Mali 400 MP2 | 1.5GHz, 600MHz | 8GB eMMC | 4GB, 1GB | 2 x 240 Pin | 4.330" L x 2.950" W (110.00mm x 75.00mm) | -40°C ~ 85°C |
|
TE0820-05-4DI81MAMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
|
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0807-03-4BE21-AMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
|
|
TE0807 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0807-03-4BE21-AKMPSOC MODULE TE0807 WITH ZYNQ UL |
0 |
|
|
TE0807 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-05-6BE21-LULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
TE0808 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-05-6BE81-LULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
- | Bulk | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - |
|
TE0808-05-6BE21-FULTRASOM+ MPSOC MODULE WITH AMD |
0 |
|
|
- | Bulk | Active | MPU Core | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) 4 x 160 Pin | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0818-01-6BE21-AULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0818-02-6BE81-AULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU6EG-1FFVC900E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-05-6BE21-AULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
TE0808 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | - | 128MB | 4GB | 4 x 160 Pin | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-05-6BE81-AULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
- | Bulk | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - |
|
TE0808-05-6BE81-EULTRASOM+ MPSOC MODULE WITH AMD |
0 |
|
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - |
|
TE0808-04-6BE21-LIC MOD SOM MPSOC 4GB XCZU6EG |
0 |
|
|
TE0808 | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
TE0808-05-6BE81-AKULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
- | Bulk | Discontinued at Digi-Key | - | - | - | - | - | - | - | - | - |
|
TE0808-05-6BE21-AKULTRASOM+ MPSOC MODULE WITH ZYNQ |
0 |
|
|
TE0808 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq™ UltraScale+™ ZU6EG-E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 160 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
|
TE0808-04-6BE21-AKIC MOD SOM MPSOC 4GB ZU6EG |
0 |
|
|
TE0808 | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | - | 128MB | 4GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
|
TE0807-03-5AI21-AMPSOC ZYNQ USCALE 4GB DDR4 |
0 |
|
|
- | Box | Active | - | - | - | - | - | - | - | - | - |
|
MOD5270BXXIC MOD COLDFIRE 95MHZ 2.064MB |
0 |
|
|
- | Bulk | Obsolete | MCU, Ethernet Core | ColdFire 5270 | - | 95MHz | 512KB | 2.064MB | RJ-45, 2x50 Header | 2.600" L x 2.000" W (66.04mm x 50.80mm) | 0°C ~ 70°C |
分类概览
微控制器、微处理器、FPGA 模块 产品与选型指南
微控制器、微处理器、FPGA 模块 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 微控制器、微处理器、FPGA 模块。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 微控制器、微处理器、FPGA 模块?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
