微控制器、微处理器、FPGA 模块
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 模块/板类型 | 核心处理器 | 协处理器 | 速度 | 闪存大小 | RAM 大小 | 连接器类型 | 尺寸 / 尺寸 | 工作温度 |
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TE0728-03-1QIC MODULE CORTEX-A9 512MB |
0 |
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TE0728 | Bulk | Active | MCU, FPGA | ARM Cortex-A9 | Zynq-7000 (Z-7020) | - | 16MB | 512MB | Samtec SEM | 2.360" L x 2.360" W (60.00mm x 60.00mm) | - |
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TE0803-04-3BE11-AIC MODULE ZYNQ USCALE 2GB 128MB |
0 |
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TE0803 | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.050" L x 2.990" W (52.00mm x 76.00mm) | 0°C ~ 85°C |
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TE0803-01-03CG-1EAIC MODULE ZYNQ USCALE 2GB 128MB |
0 |
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TE0803 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | - | 128MB | 2GB | B2B | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
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TE0741-05-A2I-1-AMODULE FPGA KINTEX |
0 |
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Kintex™-7 | Bulk | Active | FPGA | Xilinx Kintex-7 FPGA XC7K70T-2FBG676I | - | - | 32MB | - | Board-to-Board (BTB) Socket | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
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TE0600-03-83I21-AIC MODULE GIGABEE |
0 |
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- | Bulk | Not For New Designs | FPGA Core | Spartan-6 LX-150 | - | 125MHz | 16MB | 1GB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
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TE0820-05-4AE81MAMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
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- | Bulk | Active | - | - | - | - | - | - | - | - | - |
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TE0600-03-83I11-AIC MODULE GIGABEE |
0 |
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- | Bulk | Not For New Designs | FPGA Core | Spartan-6 LX-150 | - | 125MHz | 16MB | 256MB | Samtec LSHM | 1.970" L x 1.570" W (50.00mm x 40.00mm) | -40°C ~ 85°C |
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5CSX-H6-4YA-RCIC MOD CORTEX-A9 800MHZ 1GB 32MB |
0 |
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MitySOM | Bulk | Active | MPU, FPGA Core | ARM® Cortex®-A9, Cyclone V SX/SE | NEON™ SIMD | 800MHz | 32MB | 1GB | Edge Connector | 3.200" L x 1.500" W (82.00mm x 39.00mm) | 0°C ~ 70°C |
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TE0813-01-4AE11-AMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
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Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
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TE0813-02-4AE81-AMPSOC MODULE WITH AMD ZYNQ ULTRA |
0 |
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Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
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SOMOMAP3530-21-1780AGIRIC MOD CORTEX-A8 600MHZ 256MB |
0 |
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OMAP35x | Bulk | Active | MPU Core | ARM® Cortex®-A8, OMAP3530 | - | 600MHz | 512MB | 256MB | Board-to-Board (BTB) Socket - 200 | 0.590" L x 1.060" W (15.00mm x 27.00mm) | -40°C ~ 85°C |
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ME-XU5-2EG-1I-D11E-R1.2SOM ZYNQ US+ ZU2EG 2GB+0.5GB PL |
0 |
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- | Box | Obsolete | MPU, FPGA Core | ARM® Dual-/Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU | - | 600MHz, 1.5GHz | 16GB | 512MB, 2GB | 168 Pin | 2.200" L x 2.130" W (56.00mm x 54.00mm) | -40°C ~ 85°C |
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TE0813-01-3BE11-AMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
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Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 2GB | Board-to-Board (BTB) Socket - 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
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TE0813-02-3BE81-AMPSOC MODULE WITH AMD ZYNQ ULTRA |
0 |
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Zynq UltraScale+ | Bulk | Active | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket - 4 x 240 | 2.990" L x 2.050" W (76.00mm x 52.00mm) | 0°C ~ 85°C |
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TE0821-01-3BE21MLMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
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TE0823 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
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DBRF5110CIC MOD CORTEX-A9 800MHZ 1GB |
0 |
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BORA | Box | Active | MPU, FPGA Core | ARM® Cortex®-A9, XC7Z020-3 | Artix-7 | 800MHz | 1GB (NAND), 32MB (NOR) | 1GB | 3 x 140 Pins 0.6mm Pitch | - | 0°C ~ 70°C |
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TE0820-05-3BE81MAMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
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- | Bulk | Active | - | - | - | - | - | - | - | - | - |
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TE0821-01-3BE21MAMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
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TE0823 | Bulk | Discontinued at Digi-Key | MPU Core | Zynq UltraScale+ XCZU3EG-1SFVC784E | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 128MB | 2GB | 2 x 100 Pin | 1.970" L x 1.570" W (50.00mm x 40.00mm) | 0°C ~ 85°C |
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C10G-6T-4XA-RICYCLONE 10 GX MODULE, 220KLE, 1G |
0 |
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MitySOM | Bulk | Active | FPGA Core | - | - | 100MHz | 32MB | 1GB | Board to Board (BTB) Socket, Card Edge | 2.750" L x 2.400" W (69.85mm x 60.96mm) | -40°C ~ 85°C |
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AM0010-02-4AE21MAMPSOC MODULE WITH XILINX ZYNQ UL |
0 |
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Zynq® UltraScale+™ | Bulk | Active | MPU Core | Zynq™ UltraScale+™ ZU4CG-1E | - | - | 128MB | 4GB | Board-to-Board (BTB) Socket | 2.205" L x 1.575" W (56.00mm x 40.00mm) | 0°C ~ 85°C |
分类概览
微控制器、微处理器、FPGA 模块 产品与选型指南
微控制器、微处理器、FPGA 模块 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 微控制器、微处理器、FPGA 模块。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 微控制器、微处理器、FPGA 模块?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
