IC 插座
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 配对间距 | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 端接方式 | 引脚间距 | 触点表面处理 - 引脚 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 | 外壳材料 | 工作温度 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-83-318-41-530000CONN IC SKT DBL |
21 |
|
|
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-83-628-41-530000CONN IC DIP SOCKET 28POS GOLD |
50 |
|
|
110 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 300.0µin (7.62µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
|
CAP-002-01-000603 Capacitor Test Socket |
17 |
|
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
S582-11-898-15-001414898 POS BGA SOCKET .050 |
3 |
|
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
S530-10-898-15-001406898 POS BGA HEADER .050 |
5 |
|
|
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
108493-0014DDR Socket, 96 BGA 7.5 mm x 13.1 |
25 |
|
|
Grypper | Bag | Active | BGA | 96 (9 x 16) | 0.031" (0.80mm) | - | - | - | - | - | Solder | - | - | - | - | - | - |
|
|
108493-0015DDR Socket, 96 BGA 7.5 mm x 13.1 |
25 |
|
|
Grypper | Bag | Active | BGA | 96 (9 x 16) | 0.031" (0.80mm) | - | - | - | - | - | Solder | - | - | - | - | - | - |
|
|
107022-0048DDR Socket, 78 BGA 7.5 mm x 10.6 |
23 |
|
|
Grypper | Bag | Active | BGA | 78 (6 x 13) | 0.031" (0.80mm) | - | - | - | - | - | Solder | - | - | - | - | - | - |
|
|
108387-0059Socket-eMMC/UFS, 153 BGA 10.0 mm |
23 |
|
|
- | Bag | Active | BGA | 153 (12 x 13) | 0.020" (0.50mm) | - | - | - | Through Hole | - | Solder | 0.020" (0.50mm) | - | - | - | - | - |
|
|
107250-0026Socket-eMMC/UFS, 153 BGA 11.5 mm |
21 |
|
|
- | Bag | Active | BGA | 153 (12 x 13) | 0.020" (0.50mm) | - | - | - | Through Hole | - | Solder | 0.020" (0.50mm) | - | - | - | - | - |
|
|
104670-0041Socket-NAND 152 14.0 x 18.0 -1.0 |
25 |
|
|
Grypper | Bag | Active | PGA | 152 | - | - | - | - | Surface Mount | - | Solder | - | - | - | - | - | - |
|
|
108656-0036Socket-NAND 152 14.0 x 18.0 -1.0 |
25 |
|
|
Grypper | Bag | Active | PGA | 152 | - | - | - | - | Surface Mount | - | Solder | - | - | - | - | - | - |
|
|
212018NECONN IC DIP SOCKET 18POS |
840 |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212020NECONN IC DIP SOCKET 20POS |
778 |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212028WECONN IC DIP SOCKET 28POS |
848 |
|
|
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212024NECONN IC DIP SOCKET 24POS |
402 |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212028NECONN IC DIP SOCKET 28POS |
381 |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212040WECONN IC DIP SOCKET 40POS |
209 |
|
|
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -30°C ~ 85°C |
|
|
212118NECONN IC DIP SOCKET 18POS |
126 |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
|
|
212120NECONN IC DIP SOCKET 20POS |
690 |
|
|
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | - | - | - | Through Hole | Open Frame | - | 0.100" (2.54mm) | - | - | - | - | -40°C ~ 105°C |
分类概览
IC 插座 产品与选型指南
IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 IC 插座?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
