IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 制造商料号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
240-5205-00

240-5205-00

CONN SOCKET QFN 40POS GOLD

3M

6
240-5205-00数据手册 Textool™ Bulk Active QFN 40 (4 x 10) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
248-5205-00

248-5205-00

CONN SOCKET QFN 48POS GOLD

3M

13
248-5205-00数据手册 Textool™ Bulk Active QFN 48 (4 x 12) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
224-5205-01

224-5205-01

CONN SOCKET QFN 24POS GOLD

3M

22
224-5205-01数据手册 Textool™ Bulk Active QFN 24 (4x4) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
251-5949-02-0602

251-5949-02-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M

13
251-5949-02-0602数据手册 Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
361-PRS19001-12

361-PRS19001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

16
361-PRS19001-12数据手册 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
248-4205-01

248-4205-01

CONN SOCKET QFN 48POS GOLD

3M

14
248-4205-01数据手册 Textool™ Bulk Active QFN 48 (4 x 12) 0.016" (0.40mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
256-4205-01

256-4205-01

CONN SOCKET QFN 56POS GOLD

3M

8
256-4205-01数据手册 Textool™ Bulk Active QFN 56 (4 x 14) 0.016" (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016" (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES) -
280-5205-01

280-5205-01

CONN SOCKET QFN 80POS GOLD

3M

10
280-5205-01数据手册 Textool™ Bulk Active QFN 80 (4 x 20) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020" (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES) -
44-547-11E

44-547-11E

CONN SOCKET SOIC ZIF 44POS GOLD

Aries Electronics

10
44-547-11E数据手册 547 Bulk Active SOIC, ZIF (ZIP) 44 (2 x 22) - Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 20.0µin (0.51µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
110-47-306-41-001000

110-47-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

373
110-47-306-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ED020PLCZ

ED020PLCZ

CONN SOCKET PLCC 20POS TIN

On Shore Technology Inc.

663
ED020PLCZ数据手册 ED Tube Active PLCC 20 (4 x 5) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
210-47-308-41-001000

210-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

785
210-47-308-41-001000数据手册 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
EDO-32PLCZSM

EDO-32PLCZSM

CONN SOCKET PLCC 32POS

On Shore Technology Inc.

712
EDO-32PLCZSM数据手册 ED Tube Active PLCC 32 (2 x 16) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
111-47-306-41-001000

111-47-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

408
111-47-306-41-001000数据手册 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-47-308-41-001000

115-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

377
115-47-308-41-001000数据手册 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
06-0518-10H

06-0518-10H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

93
06-0518-10H数据手册 518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
8432-21A1-RK-TP

8432-21A1-RK-TP

CONN SOCKET PLCC 32POS TIN

3M

78
8432-21A1-RK-TP数据手册 8400 Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
SA486000

SA486000

CONN IC DIP SOCKET 48POS GOLD

On Shore Technology Inc.

33
SA486000数据手册 SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
115-43-314-41-001000

115-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

38
115-43-314-41-001000数据手册 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-210-41-006000

116-43-210-41-006000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

78
116-43-210-41-006000数据手册 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 1330 Record«Prev1... 4041424344454647...67Next»

分类概览

IC 插座 产品与选型指南

IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 IC 插座?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

萬通电子有限公司

搜索

萬通电子有限公司

产品

萬通电子有限公司

电话

萬通电子有限公司

用户

萬通电子有限公司 萬通电子有限公司 萬通电子有限公司
WHATSAPP

+86 13760362468

萬通电子有限公司