IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 制造商料号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
9-1437539-1

9-1437539-1

828-AG11D-ES=SOCKET ASSY

TE Connectivity AMP Connectors

1,245
9-1437539-1数据手册 800 Box Active DIP, 0.1" (2.54mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole - Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
210-43-316-41-001

210-43-316-41-001

SOCKET 16-PIN .100" X .300" MACH

Mill-Max Manufacturing Corp.

411
210-43-316-41-001数据手册 210 Box Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SMPX-84LCC-P

SMPX-84LCC-P

SMT PLCC SOCKET 84P POLARISED RO

Kycon, Inc.

195
SMPX-84LCC-P数据手册 SMPX Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
714-43-108-31-018000

714-43-108-31-018000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

646
714-43-108-31-018000数据手册 714 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
524-AG11D

524-AG11D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

1,444
524-AG11D数据手册 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Polyester -55°C ~ 125°C
524-AG11D-ESL

524-AG11D-ESL

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

259
524-AG11D-ESL数据手册 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
6-1437537-6

6-1437537-6

6-1437537-6

TE Connectivity AMP Connectors

9,007
6-1437537-6数据手册 * Box Active - - - - - - - - - - - - - - -
346-93-116-41-013000

346-93-116-41-013000

CONN SOCKET SIP 16POS GOLD

Mill-Max Manufacturing Corp.

123
346-93-116-41-013000数据手册 346 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-316-41-005000

117-43-316-41-005000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

193
117-43-316-41-005000数据手册 117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-316-10-005000

110-43-316-10-005000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

249
110-43-316-10-005000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
4-1437531-5

4-1437531-5

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

192
4-1437531-5数据手册 500 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
7-1437536-3

7-1437536-3

540-AG10D-ES=SOCKET ASSY

TE Connectivity AMP Connectors

4,246
7-1437536-3数据手册 * Tube Active - - - - - - - - - - - - - - -
614-43-324-31-012000

614-43-324-31-012000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

201
614-43-324-31-012000数据手册 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-306-10-001000

299-43-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

287
299-43-306-10-001000数据手册 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-328-10-001000

110-43-328-10-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

231
110-43-328-10-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-328-31-012000

614-43-328-31-012000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

111
614-43-328-31-012000数据手册 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICF-328-T-O

ICF-328-T-O

SKT SMT FOR 28 PIN DIP IC

Samtec Inc.

181
ICF-328-T-O数据手册 ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
8080-1G1

8080-1G1

CONN TRANSIST TO-3 4POS GOLD

TE Connectivity AMP Connectors

183
8080-1G1数据手册 8080 Bulk Obsolete Transistor, TO-3 4 (Round) - Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead - Beryllium Copper Fluoropolymer (FP) -55°C ~ 125°C
12-8473-310C

12-8473-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

165
12-8473-310C数据手册 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
8080-1G24

8080-1G24

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

380
8080-1G24数据手册 - Bulk Obsolete Transistor, TO-3 3 (Round) - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
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IC 插座 产品与选型指南

IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 IC 插座?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

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