IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 制造商料号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
2485267-3

2485267-3

DIP IC SOCKET 10P,GOLD FLASH-SMD

TE Connectivity AMP Connectors

5,400
2485267-3数据手册 - Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 10 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2485267-4

2485267-4

DIP IC SOCKET 12P,GOLD FLASH-SMD

TE Connectivity AMP Connectors

5,399
2485267-4数据手册 - Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 12 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
ICF-308-T-I-TR

ICF-308-T-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

950
ICF-308-T-I-TR数据手册 ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
05-0518-00

05-0518-00

CONN SOCKET SIP 5POS GOLD

Aries Electronics

885
05-0518-00数据手册 518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
115-47-308-41-003000

115-47-308-41-003000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,067
115-47-308-41-003000数据手册 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2445893-1

2445893-1

DIP IC SOCKET 8P SMT

TE Connectivity AMP Connectors

4,500
2445893-1数据手册 - Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
SMPX-32LCC-N

SMPX-32LCC-N

SMT PLCC SOCKET 32P NON POLARISE

Kycon, Inc.

179
SMPX-32LCC-N数据手册 SMPX Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -50°C ~ 105°C
2485264-5

2485264-5

DIP IC SOCKET 18P,SN

TE Connectivity AMP Connectors

5,720
2485264-5数据手册 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
8420-21A1-RK-TP

8420-21A1-RK-TP

CONN SOCKET PLCC 20POS TIN

3M

2,808
8420-21A1-RK-TP数据手册 8400 Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
2485264-2

2485264-2

DIP IC SOCKET 14P-SN

TE Connectivity AMP Connectors

7,641
2485264-2数据手册 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2485264-6

2485264-6

DIP IC SOCKET 20P,SN

TE Connectivity AMP Connectors

5,228
2485264-6数据手册 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2485264-3

2485264-3

DIP IC SOCKET 16P,SN

TE Connectivity AMP Connectors

6,519
2485264-3数据手册 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
8420-21B1-RK-TR

8420-21B1-RK-TR

CONN SOCKET PLCC 20POS TIN

3M

1,286
8420-21B1-RK-TR数据手册 8400 Tape & Reel (TR) Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
214-44-308-01-670799

214-44-308-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

1,000
214-44-308-01-670799数据手册 214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
110-83-316-10-003101

110-83-316-10-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,664
110-83-316-10-003101数据手册 110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2445893-3

2445893-3

DIP IC SOCKET 20P SMT

TE Connectivity AMP Connectors

3,000
2445893-3数据手册 - Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
D2608-42

D2608-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

2,312
D2608-42数据手册 D26 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2485264-4

2485264-4

DIP IC SOCKET 18P,GOLD FLASH

TE Connectivity AMP Connectors

5,280
2485264-4数据手册 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2445893-2

2445893-2

DIP IC SOCKET 16P SMT

TE Connectivity AMP Connectors

3,000
2445893-2数据手册 - Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
ICO-308-STT

ICO-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

111
ICO-308-STT数据手册 ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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IC 插座 产品与选型指南

IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 IC 插座?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

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