IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 制造商料号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
40-C212-10

40-C212-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

700
40-C212-10数据手册 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-810-90C

12-810-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

529
12-810-90C数据手册 Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-640-SGG

ICA-640-SGG

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

20
ICA-640-SGG数据手册 ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
346-93-164-41-013000

346-93-164-41-013000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

170
346-93-164-41-013000数据手册 346 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-628-G-N

APA-628-G-N

ADAPTER PLUG

Samtec Inc.

230
APA-628-G-N数据手册 APA Tube Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
20-823-90

20-823-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

802
20-823-90数据手册 Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
2350616-1

2350616-1

DUAL LGA,250 POS, DMD SOCKET

TE Connectivity AMP Connectors

296
2350616-1数据手册 - Tray Active LGA 250 (16 x 25) 0.039" (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic -25°C ~ 100°C
299-43-308-11-001000

299-43-308-11-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

704
299-43-308-11-001000数据手册 299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6823-90

40-6823-90

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

246
40-6823-90数据手册 Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
1-2324271-4

1-2324271-4

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

121
1-2324271-4数据手册 - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
2-2129710-5

2-2129710-5

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

171
2-2129710-5数据手册 - Tray Last Time Buy LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
2-2129710-6

2-2129710-6

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

249
2-2129710-6数据手册 - Tray Last Time Buy LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
264-1300-00-0602J

264-1300-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

3M

169
264-1300-00-0602J数据手册 Textool™ Tube Active DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
24-6554-16

24-6554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

73
24-6554-16数据手册 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
2-2822979-3

2-2822979-3

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

168
2-2822979-3数据手册 - Tray Last Time Buy LGA 3647 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
214-99-308-01-670800

214-99-308-01-670800

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.

1,068
214-99-308-01-670800数据手册 214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-87-310-41-134191

114-87-310-41-134191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,944
114-87-310-41-134191数据手册 114 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-47-210-41-006000

116-47-210-41-006000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2,142
116-47-210-41-006000数据手册 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
317-47-108-41-005000

317-47-108-41-005000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

470
317-47-108-41-005000数据手册 317 Tube Active SIP 8 (1 x 8) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICF-308-T-O

ICF-308-T-O

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

16
ICF-308-T-O数据手册 ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
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IC 插座 产品与选型指南

IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 IC 插座?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

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