IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 制造商料号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
08-4513-10

08-4513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

1,650
08-4513-10数据手册 Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-2513-10

08-2513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

293
08-2513-10数据手册 Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-3518-10

16-3518-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

243
16-3518-10数据手册 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-99-320-41-001000

110-99-320-41-001000

CONN IC DIP SOCKET 20POS TINLEAD

Mill-Max Manufacturing Corp.

1,808
110-99-320-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-47-103-41-005000

917-47-103-41-005000

CONN SOCKET TRANSIST TO-5 3POS

Mill-Max Manufacturing Corp.

711
917-47-103-41-005000数据手册 917 Tube Active Transistor, TO-5 3 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-320-41-001000

110-44-320-41-001000

CONN IC DIP SOCKET 20POS TIN

Mill-Max Manufacturing Corp.

489
110-44-320-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
AR 16-HZL/01-TT

AR 16-HZL/01-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

5,069
AR 16-HZL/01-TT数据手册 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
SA286040

SA286040

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

500
SA286040数据手册 SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
SA283040

SA283040

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

129
SA283040数据手册 SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
SA326000

SA326000

CONN IC DIP SOCKET 32POS GOLD

On Shore Technology Inc.

237
SA326000数据手册 SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
115-43-308-41-003000

115-43-308-41-003000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

995
115-43-308-41-003000数据手册 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
PLCC-84-AT

PLCC-84-AT

PLCC 84P THROUGH HOLE

Adam Tech

522
PLCC-84-AT数据手册 PLCC Tube Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
ICM-640-1-GT-HT

ICM-640-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 40P

Adam Tech

217
ICM-640-1-GT-HT数据手册 ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
917-47-104-41-005000

917-47-104-41-005000

CONN SOCKET TRANSIST TO-5 4POS

Mill-Max Manufacturing Corp.

804
917-47-104-41-005000数据手册 917 Tube Active Transistor, TO-5 4 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-87-318-41-134161

114-87-318-41-134161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

495
114-87-318-41-134161数据手册 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-47-320-41-001000

110-47-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

584
110-47-320-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-308-41-001000

111-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2,149
111-93-308-41-001000数据手册 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D2814-42

D2814-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

16,792
D2814-42数据手册 D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
8420-11B1-RK-TP

8420-11B1-RK-TP

CONN SOCKET PLCC 20POS TIN

3M

1,048
8420-11B1-RK-TP数据手册 8400 Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
123-83-308-41-001101

123-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,414
123-83-308-41-001101数据手册 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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IC 插座 产品与选型指南

IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 IC 插座?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

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