IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 制造商料号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
DILB28P-223TLF

DILB28P-223TLF

CONN IC DIP SOCKET 28POS TIN

Amphenol ICC (FCI)

2,755
DILB28P-223TLF数据手册 - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
4816-3004-CP

4816-3004-CP

CONN IC DIP SOCKET 16POS TIN

3M

11,641
4816-3004-CP数据手册 4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
110-47-308-41-001000

110-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

1,261
110-47-308-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
4820-3000-CP

4820-3000-CP

CONN IC DIP SOCKET 20POS TIN

3M

4,510
4820-3000-CP数据手册 4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
1-2199299-2

1-2199299-2

28P,DIP SKT,600 CL,LDR,PB FREE

TE Connectivity AMP Connectors

3,376
1-2199299-2数据手册 Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Nickel Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
1-2199298-9

1-2199298-9

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

2,752
1-2199298-9数据手册 Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
08-3518-10

08-3518-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,190
08-3518-10数据手册 518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICM-316-1-GT-HT

ICM-316-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 16P

Adam Tech

2,836
ICM-316-1-GT-HT数据手册 ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
245-40-1-06

245-40-1-06

CONN IC DIP SOCKET 40POS TIN

CNC Tech

2,230
245-40-1-06数据手册 - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
110-87-310-41-001101

110-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,346
110-87-310-41-001101数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-314-41-001101

110-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

5,221
110-87-314-41-001101数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
214-44-308-01-670800

214-44-308-01-670800

CONN IC DIP SOCKET 8POS TIN

Mill-Max Manufacturing Corp.

54,591
214-44-308-01-670800数据手册 214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D2808-42

D2808-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

29,484
D2808-42数据手册 D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
1-2199300-2

1-2199300-2

CONN IC DIP SOCKET 32POS TINLEAD

TE Connectivity AMP Connectors

3,112
1-2199300-2数据手册 Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin-Lead 60.0µin (1.52µm) Brass, Copper Polyester -55°C ~ 125°C
4824-6000-CP

4824-6000-CP

CONN IC DIP SOCKET 24POS TIN

3M

1,866
4824-6000-CP数据手册 4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
PLCC-44-AT-SMT

PLCC-44-AT-SMT

PLCC SOCKET 44P SMT

Adam Tech

2,286
PLCC-44-AT-SMT数据手册 PLCC Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Thermoplastic -55°C ~ 105°C
ICM-318-1-GT-HT

ICM-318-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 18P

Adam Tech

2,175
ICM-318-1-GT-HT数据手册 ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
2485264-1

2485264-1

DIP IC SOCKET 8P,GOLD FLASH

TE Connectivity AMP Connectors

4,766
2485264-1数据手册 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
05-0513-10T

05-0513-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics

1,152
05-0513-10T数据手册 0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
D01-9970842

D01-9970842

CONN SOCKET SIP 8POS GOLD

Harwin Inc.

7,504
D01-9970842数据手册 D01-997 Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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IC 插座 产品与选型指南

IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 IC 插座?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

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