系统级芯片(SoC)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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10AS066N1F40E1SGIC SOC CORTEX-A9 1.5GHZ 1517FBGA |
0 |
|
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Arria 10 SX | 1517-BBGA, FCBGA | Tray | Discontinued at Digi-Key | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1517-FCBGA (40x40) |
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10AS066N1F40I1SGIC SOC CORTEX-A9 1.5GHZ 1517FBGA |
0 |
|
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Arria 10 SX | 1517-BBGA, FCBGA | Tray | Discontinued at Digi-Key | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1517-FCBGA (40x40) |
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10AS066N2F40E1SGIC SOC CORTEX-A9 1.5GHZ 1517FBGA |
0 |
|
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Arria 10 SX | 1517-BBGA, FCBGA | Tray | Discontinued at Digi-Key | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1517-FCBGA (40x40) |
|
10AS066N2F40I1SGIC SOC CORTEX-A9 1.5GHZ 1517FBGA |
0 |
|
|
Arria 10 SX | 1517-BBGA, FCBGA | Tray | Discontinued at Digi-Key | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz | FPGA - 660K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1517-FCBGA (40x40) |
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XA7Z030-1FBG484IIC SOC CORTEX-A9 667MHZ 484FCBGA |
0 |
|
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Zynq®-7000 XA | 484-BBGA, FCBGA | Tray | Obsolete | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | -40°C ~ 100°C (TJ) | Automotive | AEC-Q100 | 484-FCBGA (23x23) |
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ROM-5420CD-MDA1ESBC 1.0GHZ 2 CORE 1GB/1GB RAM |
0 |
|
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SMARC | Module | Bulk | Obsolete | MPU | ARM® Cortex®-A9 | 4GB | 1GB | HDMI, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | 1GHz | - | 0°C ~ 60°C | - | - | - |
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XC7Z035-2FFV676EIC SOC CORTEX-A9 800MHZ 676FCBGA |
0 |
|
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Zynq®-7000 | 676-BBGA, FCBGA | Bulk | Obsolete | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 800MHz | Kintex™-7 FPGA, 275K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
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XC7Z045-3FFV676EIC SOC CORTEX-A9 1GHZ 676FCBGA |
0 |
|
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Zynq®-7000 | 676-BBGA, FCBGA | Bulk | Obsolete | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 350K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
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BCM1125HB0K800GMIP64 UNIPROCESSOR SOC |
0 |
|
|
* | - | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM3218SF02DOCSIS EOC WITH ONE A/D SCDMA |
0 |
|
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* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM3349SK01BCM3349+BCM3409 DOCSIS 2.0 CAB |
0 |
|
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* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM3380DKFSBGDOCSIS 3.0 VOCM SOC |
0 |
|
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* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM3382DKFEBGDOCSIS 3.0 DATA MODEM |
0 |
|
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* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM3382EKFEBGDOCSIS 3.0 DATA MODEM |
0 |
|
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* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM33843EKFSBGDOCSIS 3.0 CABLE MODEM |
0 |
|
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- | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM3384DCSA0124X8 DOCSIS 3.0 MODEM 3384D |
0 |
|
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* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM3384GCSA0124X8 DOCSIS 3.0 MODEM |
0 |
|
|
* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM43465SAM01BCM49408 + BCM43465X2 + BCM20704 |
0 |
|
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* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM43465SAP01BCM49408 + BCM43465*2 |
0 |
|
|
* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
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BCM43525SK01BCM49408 + 2X BCM43525 |
0 |
|
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* | - | Tray | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - |
分类概览
系统级芯片(SoC) 产品与选型指南
系统级芯片(SoC) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 系统级芯片(SoC)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 系统级芯片(SoC)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
