系统级芯片(SoC)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MPFS160TLS-FCSG536IIC SOC RISC-V 536LFBGA |
2 |
|
|
PolarFire® | 536-LFBGA, CSPBGA | Tray | Active | MPU, FPGA | RISC-V | 128kB | 1.4125MB | DMA, PCI, PWM | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG | - | FPGA - 161K Logic Modules | -40°C ~ 100°C | - | - | 536-LFBGA |
|
XCZU3EG-1SFVC784EIC SOC CORTEX-A53 784FCBGA |
4 |
|
|
Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
M2S150TS-1FC1152IIC SOC CORTEX-M3 166MHZ 1152BGA |
24 |
|
|
SmartFusion®2 | 1152-BBGA, FCBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 1152-FCBGA (35x35) |
|
XC7Z030-3FFG676EIC SOC CORTEX-A9 1GHZ 676FCBGA |
2 |
|
|
Zynq®-7000 | 676-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1GHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 100°C (TJ) | - | - | 676-FCBGA (27x27) |
|
A5ED065BB23AE5SR0IC MPU FPGA AGILEX5E ES 839BGA |
9 |
|
|
Agilex E | 839-FBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ | - | 512kB | DDR, DMA, PCIe, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz, 1.8GHz | FPGA - 656K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 839-VPBGA (23x23) |
|
A5ED065BB32AE4SR0IC MPU FPGA AGILEX5E ES 1591BGA |
10 |
|
|
Agilex E | 839-FBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ | - | 512kB | DDR, DMA, PCIe, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.5GHz, 1.8GHz | FPGA - 656K Logic Elements | 0°C ~ 100°C (TJ) | - | - | 1591-VPBGA (32x32) |
|
XC7Z045-1FFG900IIC SOC CORTEX-A9 667MHZ 900FCBGA |
5 |
|
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Zynq®-7000 | 900-BBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 350K Logic Cells | -40°C ~ 100°C (TJ) | - | - | 900-FCBGA (31x31) |
|
XCZU17EG-2FFVC1760EIC SOC CORTEX-A53 1760FCBGA |
8 |
|
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Zynq® UltraScale+™ MPSoC EG | 1760-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 1760-FCBGA (42.5x42.5) |
|
UPD72874AGC-YEB-ASOC / AV LINK |
29 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
KS8695CENTAUR MULTI-PORT GATEWAY |
44 |
|
|
- | 208-BFQFP | Bulk | Active | MPU | ARM922T | - | - | DMA, WDT | Ethernet | 166MHz | - | - | - | - | 208-PQFP (28x28) |
|
UPD72893BGD-LML-ASOC / AV LINK |
80 |
|
|
* | - | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - |
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PLCHIP-P10-51220X1P10 PLC ON A CHIP SINGLE, LQFP- |
2 |
|
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- | 144-LQFP | Box | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
PLCHIP-P10-51220X5P10 PLC ON A CHIP 5 PACK, LQFP- |
2 |
|
|
- | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
PLCHIP-P13-51220X5P13 PLC ON A CHIP 5 PACK, LQFP-2 |
2 |
|
|
- | 208-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 208-LQFP (28x28) |
|
|
XAZU2EG-1SFVA625IIC SOC CORTEX-A53 625FCBGA |
5 |
|
|
Zynq® UltraScale+™ MPSoC EG | 625-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 1.2MB | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | 500MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
|
PLCHIP-P10-51220X10P10 PLC ON A CHIP 10 PACK, LQFP |
2 |
|
|
- | 144-LQFP | Tray | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) | - | - | 144-LQFP (20x20) |
|
XCZU5EG-L2SFVC784EIC SOC CORTEX-A53 784FCBGA |
2 |
|
|
Zynq® UltraScale+™ MPSoC EG | 784-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 600MHz, 1.3GHz | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
|
10E00025005X0SMARC 2.1 Module |
3 |
|
|
- | Module | Bulk | Active | MPU | Intel® Atom® X5-E3940 | 32GB | 4GB | HDMI, LVDS, SATA | Ethernet, I2C, MMC/SD/SDIO, PCIe, SPI, UART, USB | - | - | -5°C ~ 60°C | - | - | - |
|
XC7Z014S-1CLG400CIC SOC CORTEX-A9 667MHZ 400BGA |
0 |
|
|
Zynq®-7000 | 400-LFBGA, CSPBGA | Tray | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 65K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 400-CSPBGA (17x17) |
|
XC7Z030-1SBG485CIC SOC CORTEX-A9 667MHZ 485FCBGA |
0 |
|
|
Zynq®-7000 | 484-FBGA, FCBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Kintex™-7 FPGA, 125K Logic Cells | 0°C ~ 85°C (TJ) | - | - | 484-FCBGA (19x19) |
分类概览
系统级芯片(SoC) 产品与选型指南
系统级芯片(SoC) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 系统级芯片(SoC)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 系统级芯片(SoC)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
