微控制器
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
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SPC5747CK1CMJ6IC MCU 32BIT 4MB FLSH 256MAPPBGA NXP USA Inc. |
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256-LBGA | MPC57xx | Bulk | Active | Not Verified | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 256-MAPPBGA (17x17) | |
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MMC2114CFCPV33IC MCU 32BIT 256KB FLASH 144LQFP NXP USA Inc. |
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144-LQFP | MCore | Tray | Obsolete | Not Verified | M210 | 16/32-Bit | 33MHz | EBI/EMI, SCI, SPI | LVD, POR, PWM, WDT | 104 | 256KB (256K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 144-LQFP (20x20) | |
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S32K328NHT1MJBSRIC MCU NXP USA Inc. |
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- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
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MCF5270CVM150IC MCU 32BIT ROMLESS 196MAPBGA NXP USA Inc. |
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196-LBGA | MCF527x | Tray | Not For New Designs | Not Verified | Coldfire V2 | 32-Bit Single-Core | 150MHz | EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, WDT | 97 | - | ROMless | - | 64K x 8 | 1.4V ~ 1.6V | - | External | -40°C ~ 85°C (TA) | - | - | Surface Mount | 196-LBGA (15x15) | |
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MC68332ACFC25IC MCU 32BIT ROMLESS 132PQFP NXP USA Inc. |
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132-BQFP Bumpered | M683xx | Tray | Obsolete | Not Verified | CPU32 | 32-Bit Single-Core | 25MHz | EBI/EMI, SCI, SPI, UART/USART | POR, PWM, WDT | 15 | - | ROMless | - | 2K x 8 | 4.5V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 132-PQFP (24.13x24.13) | |
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SP5746CBK1AMKU6RIC MCU 32BIT 3MB FLASH 176LQFP NXP USA Inc. |
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176-LQFP Exposed Pad | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 176-LQFP (24x24) | |
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SPC5746CSK1MMJ6RIC MCU 32BIT 3MB FLSH 256MAPPBGA NXP USA Inc. |
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256-LBGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 256-MAPPBGA (17x17) | |
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SP5746CSK1AMMJ6RIC MCU 32BIT 3MB FLSH 256MAPPBGA NXP USA Inc. |
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256-LBGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 256-MAPPBGA (17x17) | |
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S32K364NHT1MJBSTS32K364NHT1MJBST NXP USA Inc. |
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289-LFBGA | S32K3 | Tray | Active | - | ARM® Cortex®-M7 | 32-Bit Tri-Core | 320MHz | CANbus, I2C, QSPI, SPI, UART/USART | PWM | 209 | 4MB (4M x 8) | FLASH | - | 704K x 8 | 2.7V ~ 5.5V | - | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 289-LFBGA (14x14) | |
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SPC5746CSK1MMJ6IC MCU 32BIT 3MB FLSH 256MAPPBGA NXP USA Inc. |
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256-LBGA | MPC57xx | Bulk | Active | Not Verified | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 256-MAPPBGA (17x17) |
