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| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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S9S12G64J0VLFIC MCU 16BIT 64KB FLASH 48LQFP NXP USA Inc. |
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 数据手册
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48-LQFP | HCS12 | Tray | Active | - | S12 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 40 | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 48-LQFP (7x7) | |
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S9S12G64J1VLCIC MCU 16BIT 64KB FLASH 32LQFP NXP USA Inc. |
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数据手册
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32-LQFP | HCS12 | Tray | Active | - | S12 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 26 | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
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MKL17Z256VFM4RKINETIS KL17: 48MHZ CORTEX-M0+ U NXP USA Inc. |
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数据手册
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32-VFQFN Exposed Pad | Kinetis KL17 | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+ | 32-Bit | 48MHz | I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 28 | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D 11x16b SAR; D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 32-QFN-EP (5x5) | |
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S9S12G64J0CLHRS12 CORE,64K FLASH NXP USA Inc. |
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数据手册
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64-LQFP | HCS12 | Tape & Reel (TR) | Active | - | S12 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 54 | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) | |
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S9S12P32J0CFTIC MCU 16BIT 32KB FLASH 48QFN NXP USA Inc. |
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数据手册
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48-TFQFN Exposed Pad | HCS12 | Tray | Active | Not Verified | HCS12 | 16-Bit | 32MHz | CANbus, SCI, SPI | LVD, POR, PWM, WDT | 34 | 32KB (32K x 8) | FLASH | 4K x 8 | 2K x 8 | 1.72V ~ 5.5V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-QFN-EP (7x7) | |
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S912ZVL64F0MLCRIC MCU 16BIT 64KB FLASH 32LQFP NXP USA Inc. |
0 |
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数据手册
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32-LQFP | S12 MagniV | Tape & Reel (TR) | Active | Not Verified | S12Z | 16-Bit | 32MHz | I2C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 19 | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 5.5V ~ 18V | A/D 6x10b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
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S9S08EL16F1MTLRIC MCU 8BIT 16KB FLASH 28TSSOP NXP USA Inc. |
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数据手册
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28-TSSOP (0.173", 4.40mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 22 | 16KB (16K x 8) | FLASH | 256 x 8 | 512 x 8 | 2.7V ~ 5.5V | A/D 16x10b | External | -40°C ~ 125°C (TA) | - | - | Surface Mount | 28-TSSOP | |
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S912ZVLA64F0VFMRS912ZVLA64F0VFMR NXP USA Inc. |
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数据手册
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32-VFQFN Exposed Pad | S12 MagniV | Tape & Reel (TR) | Active | - | S12Z | 16-Bit | 32MHz | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 19 | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 5.5V ~ 18V | A/D 6x10b SAR; D/A 1x8b | External, Internal | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 32-QFN-EP (5x5) | |
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S9S08RNA60W1MLHIC MCU 8BIT 60KB FLASH 64LQFP NXP USA Inc. |
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数据手册
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64-LQFP | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 55 | 60KB (60K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) | |
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S9S12G64F0VLHIC MCU 16BIT 64KB FLASH 64LQFP NXP USA Inc. |
0 |
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数据手册
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64-LQFP | HCS12 | Tray | Active | Not Verified | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 54 | 64KB (64K x 8) | FLASH | 2K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) |
