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| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC9S08SU16VFKIC MCU 8BIT 16KB FLASH 24QFN NXP USA Inc. |
0 |
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 数据手册
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24-UFQFN Exposed Pad | S08 | Bulk | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, SCI | PWM, WDT | 17 | 16KB (16K x 8) | FLASH | - | 768 x 8 | 4.5V ~ 18V | A/D 8x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 24-QFN (4x4) | |
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S9S08RNA32W1MLHIC MCU 8BIT 32KB FLASH 64LQFP NXP USA Inc. |
0 |
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数据手册
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64-LQFP | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 55 | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) | |
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LPC11U34FHN33/421,IC MCU 32BIT 48KB FLASH 32HVQFN NXP USA Inc. |
0 |
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数据手册
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32-VQFN Exposed Pad | LPC11Uxx | Tray | Active | Not Verified | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 26 | 48KB (48K x 8) | FLASH | 4K x 8 | 10K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 32-HVQFN (7x7) | |
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MCF51QU32VHSIC MCU 32BIT 32KB FLASH 44MAPLGA NXP USA Inc. |
0 |
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数据手册
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44-VFLGA Exposed Pad | MCF51Qx | Tray | Active | Not Verified | Coldfire V1 | 32-Bit Single-Core | 50MHz | EBI/EMI, I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 31 | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.71V ~ 3.6V | A/D 11x12b; D/A 1x12b | External | -40°C ~ 105°C (TA) | - | - | Surface Mount | 44-MAPLGA (5x5) | |
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EM773FHN33,551IC MCU 32BIT 32KB FLASH 32HVQFN NXP USA Inc. |
0 |
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数据手册
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32-VQFN Exposed Pad | - | Tray | Obsolete | Not Verified | ARM® Cortex®-M0 | 32-Bit Single-Core | 48MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 25 | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 32-HVQFN (7x7) | |
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S9S08SG16E1WTGIC MCU 8BIT 16KB FLASH 16TSSOP NXP USA Inc. |
0 |
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数据手册
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16-TSSOP (0.173", 4.40mm Width) | S08 | Bulk | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 12 | 16KB (16K x 8) | FLASH | - | 1K x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 150°C (TA) | - | - | Surface Mount | 16-TSSOP | |
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S9S12GN48J1VLCIC MCU 16BIT 48KB FLASH 32LQFP NXP USA Inc. |
0 |
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数据手册
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32-LQFP | HCS12 | Tray | Active | - | S12 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 26 | 48KB (48K x 8) | FLASH | 1.5K x 8 | 4K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
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MC9S08JS16CFKIC MCU 8BIT 16KB FLASH 24QFN NXP USA Inc. |
0 |
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数据手册
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24-VQFN Exposed Pad | S08 | Bulk | Not For New Designs | Not Verified | S08 | 8-Bit | 48MHz | LINbus, SCI, SPI, USB | LVD, POR, PWM | 14 | 16KB (16K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-HVQFN (5x5) | |
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MC9S08JS16LCFKIC MCU 8BIT 16KB FLASH 24QFN NXP USA Inc. |
0 |
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数据手册
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24-VQFN Exposed Pad | S08 | Bulk | Not For New Designs | Not Verified | S08 | 8-Bit | 48MHz | LINbus, SCI, SPI, USB | LVD, POR, PWM | 14 | 16KB (16K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 24-HVQFN (5x5) | |
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MKV11Z64VLF7IC MCU 32BIT 64KB FLASH 48LQFP NXP USA Inc. |
0 |
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数据手册
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48-LQFP | Kinetis KV | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 75MHz | CANbus, I2C, SPI, UART/USART | DMA, LVD, POR, WDT | 40 | 64KB (64K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 2x16b; D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 48-LQFP (7x7) |
