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| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC9S08LL16CLHRIC MCU 8BIT 16KB FLASH 64LQFP NXP USA Inc. |
0 |
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 数据手册
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64-LQFP | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 8-Bit | 20MHz | I2C, SCI, SPI | LCD, LVD, POR, PWM, WDT | 38 | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.8V ~ 3.6V | A/D 8x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) | |
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MC9S08QG4CPAEIC MCU 8BIT 4KB FLASH 8DIP NXP USA Inc. |
0 |
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数据手册
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8-DIP (0.300", 7.62mm) | S08 | Tube | Obsolete | Not Verified | S08 | 8-Bit | 20MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | 4 | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | -40°C ~ 85°C (TA) | - | - | Through Hole | 8-PDIP | |
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S9S12GN16J1MLCIC MCU 16BIT 16KB FLASH 32LQFP NXP USA Inc. |
0 |
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数据手册
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32-LQFP | HCS12 | Tray | Active | - | S12 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 26 | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
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P89LPC9321FN,112IC MCU 8BIT 8KB FLASH 28DIP NXP USA Inc. |
0 |
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数据手册
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28-DIP (0.600", 15.24mm) | LPC900 | Tube | Obsolete | Not Verified | 8051 | 8-Bit | 18MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 26 | 8KB (8K x 8) | FLASH | 512 x 8 | 768 x 8 | 2.4V ~ 3.6V | - | Internal | -40°C ~ 85°C (TA) | - | - | Through Hole | 28-DIP | |
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MC9S08QG84CDTEIC MCU 8BIT 8KB FLASH 16TSSOP NXP USA Inc. |
0 |
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数据手册
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16-TSSOP (0.173", 4.40mm Width) | S08 | Bulk | Active | Verified | S08 | 8-Bit | 20MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | 12 | 8KB (8K x 8) | FLASH | - | 512 x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C | - | - | Surface Mount | 16-TSSOP | |
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S9S12GN32J0VLFIC MCU 16BIT 32KB FLASH 48LQFP NXP USA Inc. |
0 |
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数据手册
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48-LQFP | HCS12 | Tray | Active | - | S12 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 40 | 32KB (32K x 8) | FLASH | 1K x 8 | 2K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 48-LQFP (7x7) | |
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MC9S08QD2CSCRIC MCU 8BIT 2KB FLASH 8SOIC NXP USA Inc. |
0 |
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数据手册
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8-SOIC (0.154", 3.90mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 2KB (2K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 4x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-SOIC | |
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MKV10Z128VFM7IC MCU 32BIT 128KB FLASH 32QFN NXP USA Inc. |
0 |
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数据手册
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32-VFQFN Exposed Pad | Kinetis KV | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 75MHz | I2C, SPI, UART/USART | DMA, LVD, POR, WDT | 28 | 128KB (128K x 8) | FLASH | - | 16K x 8 | 1.71V ~ 3.6V | A/D 2x16b; D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 32-HVQFN (5x5) | |
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MKL13Z32VLK4IC MCU 32BIT 32KB FLASH 80FQFP NXP USA Inc. |
0 |
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数据手册
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80-LQFP | Kinetis KL13 | Tray | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | FlexIO, I2C, IrDA, SPI, UART/USART | DMA, PWM, WDT | 70 | 32KB (32K x 8) | FLASH | - | 4K x 8 | 1.71V ~ 3.6V | A/D 20x16b; D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 80-FQFP (12x12) | |
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LPC1113FHN33/201,5IC MCU 32BIT 24KB FLASH 32HVQFN NXP USA Inc. |
0 |
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数据手册
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32-VQFN Exposed Pad | LPC1100 | Tray | Active | Not Verified | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 28 | 24KB (24K x 8) | FLASH | - | 4K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 32-HVQFN (7x7) |
