IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

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图片 制造商料号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
110-13-640-41-001000

110-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

148
110-13-640-41-001000数据手册 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
25-0511-10

25-0511-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

379
25-0511-10数据手册 511 Tube Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
299-93-314-10-001000

299-93-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

152
299-93-314-10-001000数据手册 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
10-2820-90C

10-2820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

368
10-2820-90C数据手册 Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-820-90T

14-820-90T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

264
14-820-90T数据手册 Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
299-43-610-10-002000

299-43-610-10-002000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

165
299-43-610-10-002000数据手册 299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-964-41-001000

110-43-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

103
110-43-964-41-001000数据手册 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
10-2810-90

10-2810-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

500
10-2810-90数据手册 Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
14-810-90

14-810-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

573
14-810-90数据手册 Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
299-43-320-10-001000

299-43-320-10-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

173
299-43-320-10-001000数据手册 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2041549-1

2041549-1

SOCKET ASSY, DMD 350, T/R, G/F

TE Connectivity AMP Connectors

442
2041549-1数据手册 DMD Tape & Reel (TR) Active PGA, ZIF (ZIP) 350 (35 x 36) 0.050" (1.27mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Copper Alloy Liquid Crystal Polymer (LCP), Glass Filled -55°C ~ 105°C
28-526-10

28-526-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

200
28-526-10数据手册 Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
TCC05DCSN-S1403

TCC05DCSN-S1403

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions

102
TCC05DCSN-S1403数据手册 - Tray Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 175°C
110-43-308-41-105000

110-43-308-41-105000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

119
110-43-308-41-105000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
32-6554-10

32-6554-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

216
32-6554-10数据手册 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
32-6554-11

32-6554-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

165
32-6554-11数据手册 55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
1-2324271-3

1-2324271-3

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

4,159
1-2324271-3数据手册 - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
714-43-264-31-018000

714-43-264-31-018000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

129
714-43-264-31-018000数据手册 714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-2324271-2

1-2324271-2

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

3,756
1-2324271-2数据手册 - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -25°C ~ 100°C
1-2324271-1

1-2324271-1

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

215
1-2324271-1数据手册 - Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -25°C ~ 100°C
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IC 插座 产品与选型指南

IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 IC 插座?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

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