IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度

全部重置
全部应用
结果
图片 制造商料号 库存情况 价格 数量 数据手册 系列 包装 产品状态 类型 位置或引脚数量(网格) 配对间距 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 端接方式 引脚间距 触点表面处理 - 引脚 触点表面处理厚度 - 引脚 触点材料 - 引脚 外壳材料 工作温度
A-CCS 044-Z-T

A-CCS 044-Z-T

CONN SOCKET PLCC 44POS TIN

Assmann WSW Components

7,055
A-CCS 044-Z-T数据手册 - Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
D01-9972042

D01-9972042

CONN SOCKET SIP 20POS GOLD

Harwin Inc.

8,730
D01-9972042数据手册 D01-997 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-44-424-41-001000

110-44-424-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

1,703
110-44-424-41-001000数据手册 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-032-17-400000

940-44-032-17-400000

CONN SOCKET PLCC 32POS TIN

Mill-Max Manufacturing Corp.

1,810
940-44-032-17-400000数据手册 940 Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
10-3513-10

10-3513-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

1,452
10-3513-10数据手册 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-13-308-41-001000

110-13-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

600
110-13-308-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D2816-42

D2816-42

CONN IC DIP SOCKET 16POS GOLD

Harwin Inc.

2,770
D2816-42数据手册 D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
214-44-314-01-670800

214-44-314-01-670800

CONN IC DIP SOCKET 14POS TIN

Mill-Max Manufacturing Corp.

9,045
214-44-314-01-670800数据手册 214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SA406000

SA406000

CONN IC DIP SOCKET 40POS GOLD

On Shore Technology Inc.

1,417
SA406000数据手册 SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
8432-21B1-RK-TP

8432-21B1-RK-TP

CONN SOCKET PLCC 32POS TIN

3M

2,433
8432-21B1-RK-TP数据手册 8400 Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
08-3518-00

08-3518-00

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

947
08-3518-00数据手册 518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-43-314-41-001000

110-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3,002
110-43-314-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-314-41-001000

110-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2,715
110-93-314-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-328-41-001000

110-44-328-41-001000

CONN IC DIP SOCKET 28POS TIN

Mill-Max Manufacturing Corp.

1,520
110-44-328-41-001000数据手册 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-44-628-41-001000

110-44-628-41-001000

CONN IC DIP SOCKET 28POS TIN

Mill-Max Manufacturing Corp.

1,002
110-44-628-41-001000数据手册 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-044-17-400000

940-44-044-17-400000

CONN SOCKET PLCC 44POS TIN

Mill-Max Manufacturing Corp.

4,947
940-44-044-17-400000数据手册 940 Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
8444-11B1-RK-TP

8444-11B1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

1,492
8444-11B1-RK-TP数据手册 8400 Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
8444-21B1-RK-TP

8444-21B1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

2,201
8444-21B1-RK-TP数据手册 8400 Tube Active PLCC 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A-CCS 068-Z-T

A-CCS 068-Z-T

CONN SOCKET PLCC 68POS TIN

Assmann WSW Components

1,252
A-CCS 068-Z-T数据手册 - Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -40°C ~ 105°C
917-43-103-41-005000

917-43-103-41-005000

CONN TRANSIST TO-5 3POS GOLD

Mill-Max Manufacturing Corp.

932
917-43-103-41-005000数据手册 917 Tube Active Transistor, TO-5 3 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 1330 Record«Prev12345...67Next»

分类概览

IC 插座 产品与选型指南

IC 插座 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 IC 插座。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 IC 插座?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

萬通电子有限公司

搜索

萬通电子有限公司

产品

萬通电子有限公司

电话

萬通电子有限公司

用户

萬通电子有限公司 萬通电子有限公司 萬通电子有限公司
WHATSAPP

+86 13760362468

萬通电子有限公司