射频杂项 IC 和模块
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 功能 | 频率 | 射频类型 | 次级属性 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MAX5862AUXH+INTEGRATED 8-CHANNEL DOWNSTREAM |
0 |
|
|
- | 280-LFBGA, FCBGA | Tray | Active | Modulator | 47MHz ~ 1.006GHz | General Purpose | Up Converter | - | - | Surface Mount | 280-FCBGA (12x17) |
|
TGP2105-SM6-18 GHZ 6-BIT DIG PHASE SHIFTER |
168 |
|
|
- | 32-PowerQFN | Bulk | Active | Phase Shifter | 6GHz ~ 18GHz | General Purpose | 6-Bit | - | - | Surface Mount | 32-PQFN (5x5) |
|
AD6649BCPZIC IF RCVR 14BIT 250MSPS 64LFCSP |
0 |
|
|
- | 64-VFQFN Exposed Pad, CSP | Tray | Active | IF Diversity Receiver | - | CDMA2000, GSM/EDGE | Sample Rates to 250MSPS | - | - | Surface Mount | 64-LFCSP-VQ (9x9) |
|
HMC723LC3CIC FLIP-FLOP PROGR 13BGPS 16SMD |
0 |
|
|
- | 16-LFCQFN Exposed Pad | Strip | Active | Flip-Flop | 0Hz ~ 13GHz | General Purpose | - | - | - | Surface Mount | 16-CSMT (3x3) |
|
HMC859LC3IC DIVIDE-BY-8 W/RESET 16SMD |
0 |
|
|
- | 16-LFCQFN Exposed Pad | Strip | Active | Divide-by-8 | 0Hz ~ 26GHz | General Purpose | With Reset | - | - | Surface Mount | 16-CSMT (3x3) |
|
ADMV1013ACCZ-R7HIGH BAND POINT-TO-POINT UPCONVE |
400 |
|
|
- | 40-WFLGA Exposed Pad | Tape & Reel (TR) | Active | Upconverter | 24GHz ~ 44GHz | Radar | SPI Interface | - | - | Surface Mount | 40-LGA (6x6) |
|
AD6674BCPZ-500IC ADC IF RX 2CH 500MSPS |
0 |
|
|
- | 64-WFQFN Exposed Pad, CSP | Tray | Active | IF Receiver | 385MHz | Cellular | - | - | - | Surface Mount | 64-LFCSP (9x9) |
|
AD6679BBPZ-500IC RCVR IF BW DIVERSITY 196BGA |
0 |
|
|
- | 196-LFBGA Exposed Pad | Tray | Active | Receiver | 135MHz | General Purpose | - | - | - | Surface Mount | 196-BGA-ED (12x12) |
|
AD6636CBCZIC MIXER DOWN CONVRT 256CSBGA |
0 |
|
|
AD6636 | 256-BGA, CSPBGA | Tray | Active | - | - | CDMA2000, Cellular, EDGE, GPRS, GSM | Down Converter | - | - | Surface Mount | 256-CSPBGA (17x17) |
|
MAX9989ETP+IC BUFFER LO 20-TQFN |
0 |
|
|
- | 20-WQFN Exposed Pad | Tube | Active | LO Buffers | 700MHz ~ 1.1GHz | Cellular, GSM | 40dB Reverse Isolation | - | - | Surface Mount | 20-TQFN (5x5) |
|
MAX2023ETX+IC MOD/DEMOD HI DYN RNG 36-TQFN |
0 |
|
|
- | 36-WFQFN Exposed Pad | Tube | Active | Modulator/Demodulator | 1.5GHz ~ 2.5GHz | CDMA, EDGE, GSM, TDMA | Up/Down Converter | - | - | Surface Mount | 36-TQFN (6x6) |
|
MAX2880ETP+RF FRACT INTEGER N SYNTH QFN |
0 |
|
|
- | 20-WFQFN Exposed Pad | Tube | Active | Fractional, Integer-N Synthesizer | 12.6GHz | General Purpose | - | - | - | Surface Mount | 20-TQFN (4x4) |
|
MAX2121BETI+IC RF TUNER 28TQFN |
0 |
|
|
- | 28-WFQFN Exposed Pad | Tube | Active | Tuner | 925MHz ~ 2.175GHz | VSAT | - | - | - | Surface Mount | 28-TQFN (5x5) |
|
ADMV7420BCEZIC RF DOWNCONV E-BAND 81-86GHZ 5 |
0 |
|
|
ADMV7420 | 34-BFLGA Exposed Pad | Tray | Active | Downconverter | 81GHz ~ 86GHz | General Purpose | - | - | - | Surface Mount | 34-LGA-CAV (13x11) |
|
ADMV7310BCEZIC RF UPCONVERTER 71-76GHZ 50LGA |
0 |
|
|
ADMV7310 | 50-BFLGA Exposed Pad | Tray | Active | Upconverter | 71GHz ~ 76GHz | General Purpose | - | - | - | Surface Mount | 50-LGA-CAV (16x14) |
|
ADMV7410BCEZIC RF DOWNCONV E-BAND 71-76GHZ 5 |
0 |
|
|
ADMV7410 | 34-BFLGA Exposed Pad | Tray | Active | Downconverter | 71GHz ~ 76GHz | General Purpose | - | - | - | Surface Mount | 34-LGA-CAV (13x11) |
|
MAX2055EUP+DIGITALLY CONTROLLED, VARIABLE-G |
0 |
|
|
- | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | Tube | Active | ADC Driver/Amplifier | 30MHz ~ 300MHz | Cellular | 4.75V ~ 5.25V Supply | - | - | Surface Mount | 20-TSSOP-EP |
|
SKY77592-21IC RF TXRX FEM MOD 28MCM |
879,000 |
|
|
- | - | Tape & Reel (TR) | Obsolete | - | - | - | - | - | - | Surface Mount | - |
|
SKY77184-13CDMA2000 BAND V AND BAND II BYPA |
13,500 |
|
|
* | - | Tape & Reel (TR) | Discontinued at Digi-Key | - | - | - | - | - | - | - | - |
|
SE2602T-R11BGN FEM WITH BLUETOOTH PORT |
3,000 |
|
|
* | - | Tape & Reel (TR) | Discontinued at Digi-Key | - | - | - | - | - | - | - | - |
分类概览
射频杂项 IC 和模块 产品与选型指南
射频杂项 IC 和模块 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 射频杂项 IC 和模块。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 射频杂项 IC 和模块?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
