射频杂项 IC 和模块
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 功能 | 频率 | 射频类型 | 次级属性 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
LTC4557EUD#TRPBFIC DUAL SIM/SMART CARD PS 16QFN |
662 |
|
|
- | 16-WFQFN Exposed Pad | Tape & Reel (TR) | Active | Power Management, Signal Level Translation | - | Cellular, 3G, GSM | SIM and Smart Card Interface | - | - | Surface Mount | 16-QFN (3x3) |
|
LTC4557EUD#PBFIC DUAL SIM/SMART CARD PS 16QFN |
126 |
|
|
- | 16-WFQFN Exposed Pad | Tube | Active | Power Management, Signal Level Translation | - | Cellular, 3G, GSM | SIM and Smart Card Interface | - | - | Surface Mount | 16-QFN (3x3) |
|
LTC4558EUD#PBFIC SIM/SMART CARD PS 20-QFN |
107 |
|
|
- | 20-WFQFN Exposed Pad | Tube | Active | Power Management, Signal Level Translation | - | Cellular, 3G, GSM | SIM and Smart Card Interface | - | - | Surface Mount | 20-QFN (3x3) |
|
TL852CNIC SONAR RANGING RECEIVER 16-DIP |
19 |
|
|
- | 16-DIP (0.300", 7.62mm) | Bulk | Active | Sonar Ranging Receiver | 20kHz ~ 90kHz | Sonar Control | - | - | - | Through Hole | 16-PDIP |
|
ADMV2101BRHZINGAP HBT DIVIDE-BY-4 SMT, DC - |
245 |
|
|
- | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad | Tape & Reel (TR) | Active | Frequency Divider | 50MHz ~ 4GHz | General Purpose | Divide by 4 | - | - | Surface Mount | 8-MSOP-EP |
|
MADR-009190-00GDIEGEL PACK 100PCE ,QUAD FET AND PI |
1,000 |
|
|
- | Die | Tray | Active | Driver | - | General Purpose | - | - | - | Surface Mount | Die |
|
MADRCC0007DRIVER SMT ASIC |
622 |
|
|
- | 16-SOIC (0.154", 3.90mm Width) | Tube | Active | Driver | - | General Purpose | - | - | - | Surface Mount | 16-SOIC |
|
MAX2172ETL/V+IC TUNER LOW IF CONV DGTL 40TQFN |
102 |
|
|
- | 40-WFQFN Exposed Pad | Tube | Active | Tuner | 87MHz ~ 108MHz, 168MHz ~ 240MHz, 1.452GHz ~ 1.492GHz | General Purpose | Direct Conversion | - | - | Surface Mount | 40-TQFN (6x6) |
|
MAX1005CEE+IC UNDERSAMPLER IF 16-QSOP |
100 |
|
|
- | 16-SSOP (0.154", 3.90mm Width) | Tube | Active | IF Undersampler | - | PCS, PHS, WLL | Parallel Logic Interface | - | - | Surface Mount | 16-QSOP |
|
ADL5390ACPZ-WPIC MULTIPLIER RF VECTOR 24-LFCSP |
0 |
|
|
- | 24-VFQFN Exposed Pad, CSP | Tray | Discontinued at Digi-Key | RF/IF Vector Multiplier | 20MHz ~ 2.4GHz | Broadcast Television | - | - | - | Surface Mount | 24-LFCSP-VQ (4x4) |
|
MAX2121ETI+RF RECEIVER |
0 |
|
|
- | 28-WFQFN Exposed Pad | Tube | Active | Tuner | 925MHz ~ 2.175GHz | L-Band | Direct Conversion | - | - | Surface Mount | 28-TQFN (5x5) |
|
CMX881E1-TR1KBASEBAND PROCESSOR IC FOR PMR AN |
200 |
|
|
- | 28-TSSOP (0.173", 4.40mm Width) | Tape & Reel (TR) | Active | Baseband Processor | - | General Purpose | 2.7V ~ 5.5V Supply | - | - | Surface Mount | 28-TSSOP |
|
MAX2055EUP+DIC ADC DRVR/AMP VAR GAIN 20TSSOP |
696 |
|
|
- | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | Tube | Active | ADC Driver/Amplifier | 30MHz ~ 300MHz | Cellular, ATE, PHS/PAS | 40dBm Output IP3 | - | - | Surface Mount | 20-TSSOP-EP |
|
HMC361S8GETRIC FREQ DIVIDER DC-10GHZ 8SOIC |
52 |
|
|
- | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | Tape & Reel (TR) | Active | Prescaler | 0Hz ~ 10GHz | General Purpose | Divide by 2 | - | - | Surface Mount | 8-SOIC |
|
HMC434SRJZ-EP-R7EP INGAP HBT DIVIDE-BY-8 |
412 |
|
|
- | SOT-23-6 | Tape & Reel (TR) | Active | Prescaler | - | WLAN | - | - | - | Surface Mount | SOT-23-6 |
|
|
HMC416LP4EIC MMIC AMP VCO BUFFER 24-QFN |
54 |
|
|
- | 24-VFQFN Exposed Pad | Strip | Active | VCO, Buffer Amp | 2.75GHz ~ 3GHz | General Purpose | - | - | - | Surface Mount | 24-QFN (4x4) |
|
HMC389LP4EIC MMIC AMP VCO BUFFER 24-QFN |
41 |
|
|
- | 24-VFQFN Exposed Pad | Strip | Active | VCO, Buffer Amp | 3.35GHz ~ 3.55GHz | General Purpose | - | - | - | Surface Mount | 24-QFN (4x4) |
|
AD8283WBCPZIC RADAR RECEIVE AFE 6CH 72LFCSP |
146 |
|
|
- | 72-VFQFN Exposed Pad, CSP | Tray | Active | Receiver | - | Radar | - | Automotive | - | Surface Mount | 72-LFCSP-VQ (10x9.75) |
|
AD8284WCSVZIC ADC 12BIT AFE 4CH MUX 64TQFP |
26 |
|
|
- | 64-TQFP Exposed Pad | Tray | Active | Front End | - | Radar | ADC | Automotive | - | Surface Mount | 64-TQFP-EP (10x10) |
|
HMC369LP3EIC MULTIPLIER X2 ACTIVE 16-QFN |
57 |
|
|
- | 16-VFQFN Exposed Pad | Strip | Active | Frequency Multiplier | 9.9GHz ~ 12.7GHz | X-Band | Active Frequency Multiplier | - | - | Surface Mount | 16-QFN (3x3) |
分类概览
射频杂项 IC 和模块 产品与选型指南
射频杂项 IC 和模块 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 射频杂项 IC 和模块。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 射频杂项 IC 和模块?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
