系统级芯片(SoC)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 架构 | 核心处理器 | 闪存大小 | RAM 大小 | 外设 | 连接性 | 速度 | 主要属性 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
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XCZU1CG-2UBVA494EIC ZUP MPSOC CG A53 FPGA 494BGA |
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Zynq® UltraScale+™ MPSoC CG | 494-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 494-FCBGA (14x14) |
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XCZU1CG-1SFVC784IIC ZUP MPSOC A53 FPGA 784BGA |
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Zynq® UltraScale+™ | 784-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 784-FCBGA (23x23) |
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5CSXFC5C6U23C6NIC SOC CORTEX-A9 925MHZ 672UBGA |
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Cyclone® V SX | 672-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 85K Logic Elements | 0°C ~ 85°C (TJ) | - | - | 672-UBGA (23x23) |
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SOM-2569BCBC-S1A1SBC 1.1GHZ 2 CORE 8GB/0GB RAM |
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- | Module | Bulk | Active | MPU | Celeron N3350 | 32GB | 8GB | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.1GHz | - | 0°C ~ 60°C | - | - | - |
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M2S150-FCV484IC SOC CORTEX-M3 166MHZ 484FBGA |
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SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
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M2S150-FCVG484IC SOC CORTEX-M3 166MHZ 484FBGA |
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SmartFusion®2 | 484-BFBGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 150K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (19x19) |
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XCZU2EG-1SBVA484EIC SOC CORTEX-A53 484FCBGA |
0 |
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Zynq® UltraScale+™ MPSoC EG | 484-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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XCZU1CG-2SBVA484EIC ZUP MPSOC A53 FPGA 484BGA |
0 |
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Zynq® UltraScale+™ | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 533MHz, 1.333GHz | - | 0°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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XCZU1CG-L1SBVA484IIC ZUP MPSOC LP A53 FPGA 484BGA |
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Zynq® UltraScale+™ | 484-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DMA, WDT | - | 500MHz, 1.2GHz | - | -40°C ~ 100°C (TJ) | - | - | 484-FCBGA (19x19) |
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M2S090T-1FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
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SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090T-1FG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
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SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-1FG676IC SOC CORTEX-M3 166MHZ 676FBGA |
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SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-1FGG676IC SOC CORTEX-M3 166MHZ 676FBGA |
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SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-FG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
0 |
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SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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M2S090TS-FGG676IIC SOC CORTEX-M3 166MHZ 676FBGA |
0 |
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SmartFusion®2 | 676-BGA | Tray | Active | MCU, FPGA | ARM® Cortex®-M3 | 512KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | 166MHz | FPGA - 90K Logic Modules | -40°C ~ 100°C (TJ) | - | - | 676-FBGA (27x27) |
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5CSEBA6U19I7LNIC SOC CORTEX-A9 925MHZ 484UBGA |
0 |
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Cyclone® V SE | 484-FBGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 925MHz | FPGA - 110K Logic Elements | -40°C ~ 100°C (TJ) | - | - | 484-UBGA (19x19) |
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5CSEMA5F31A7NIC SOC CORTEX-A9 700MHZ 896FBGA |
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Cyclone® V SE | 896-BGA | Tray | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 64KB | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 700MHz | FPGA - 85K Logic Elements | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | 896-FBGA (31x31) |
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RC12-5520-2311-I2-VSBC 1.5GHZ 10 CORE 2GB/0GB RAM |
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- | Module | Box | Active | MPU | ARM® Cortex®-A53, ARM® Cortex®-M4 | - | 2GB | HDMI, LVDS | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB | 1.5GHz | - | -40°C ~ 85°C | - | - | - |
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XCZU2EG-1SFVA625EIC SOC CORTEX-A53 625FCBGA |
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Zynq® UltraScale+™ MPSoC EG | 625-BFBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 0°C ~ 100°C (TJ) | - | - | 625-FCBGA (21x21) |
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XCZU1EG-1UBVA494IIC ZUP MPSOC EG A53 FPGA 494BGA |
0 |
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Zynq® UltraScale+™ MPSoC EG | 494-WFBGA, FCBGA | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | 256KB | DMA, WDT | - | 500MHz, 600MHz, 1.2GHz | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 494-FCBGA (14x14) |
分类概览
系统级芯片(SoC) 产品与选型指南
系统级芯片(SoC) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 系统级芯片(SoC)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 系统级芯片(SoC)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
