系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

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图片 制造商料号 库存情况 价格 数量 数据手册 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
XCZU48DR-1FFVE1156I

XCZU48DR-1FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0
XCZU48DR-1FFVE1156I数据手册 Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU48DR-1FSVE1156I

XCZU48DR-1FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0
XCZU48DR-1FSVE1156I数据手册 Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 500MHz, 1.2GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
1SX250HH1F55I1VG

1SX250HH1F55I1VG

IC FPGA STRATIX 10 2912FBGA

Intel

0
1SX250HH1F55I1VG数据手册 Stratix® 10 SX 2912-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2912-FBGA, FC (55x55)
XCVE2602-2HSINSVH1369

XCVE2602-2HSINSVH1369

XCVE2602-2HSINSVH1369

AMD

0
XCVE2602-2HSINSVH1369数据手册 - - Bulk Active - - - - - - - - - - - -
AGFA019R24C2I1VB

AGFA019R24C2I1VB

IC FPGA AGILEX-F 2340BGA

Intel

0
AGFA019R24C2I1VB数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA019R24C2I1V

AGFA019R24C2I1V

AGFA019R24C2I1V

Intel

0
AGFA019R24C2I1V数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
XCVC1702-2LSENSVG1369

XCVC1702-2LSENSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

0
XCVC1702-2LSENSVG1369数据手册 Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 450MHz, 1.08GHz Versal™ AI Core FPGA, 1M Logic Cells 0°C ~ 100°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-1LSINSVG1369

XCVC1702-1LSINSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

0
XCVC1702-1LSINSVG1369数据手册 Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - - DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 400MHz, 1GHz Versal™ AI Core FPGA, 1M Logic Cells -40°C ~ 100°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-1MLINSVG1369

XCVC1702-1MLINSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

0
XCVC1702-1MLINSVG1369数据手册 Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.3GHz Versal™ AI Core FPGA, 1M Logic Cells -40°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
XCVC1702-2MLENSVG1369

XCVC1702-2MLENSVG1369

IC VERSAL AI-CORE FPGA 1369BGA

AMD

0
XCVC1702-2MLENSVG1369数据手册 Versal™ AI Core 1369-BFBGA, FCBGA Tray Active MPU, FPGA Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 600MHz, 1.4GHz Versal™ AI Core FPGA, 1M Logic Cells 0°C ~ 110°C (TJ) - - 1369-FCBGA (35x35)
AGFB019R24C2I1VB

AGFB019R24C2I1VB

IC FPGA AGILEX-F 2340BGA

Intel

0
AGFB019R24C2I1VB数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFB019R24C2I1V

AGFB019R24C2I1V

AGFB019R24C2I1V

Intel

0
AGFB019R24C2I1V数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements -40°C ~ 100°C (TJ) - - 2340-BGA (45x42)
1SX250HN1F43I1VG

1SX250HN1F43I1VG

IC FPGA STRATIX 10 1760FBGA

Intel

0
1SX250HN1F43I1VG数据手册 Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX250HU1F50E1VG

1SX250HU1F50E1VG

IC FPGA STRATIX 10 2397FBGA

Intel

0
1SX250HU1F50E1VG数据手册 Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
XCZU43DR-2FSVE1156I

XCZU43DR-2FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0
XCZU43DR-2FSVE1156I数据手册 Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-2FFVE1156I

XCZU47DR-2FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0
XCZU47DR-2FFVE1156I数据手册 Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU43DR-2FFVE1156I

XCZU43DR-2FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0
XCZU43DR-2FFVE1156I数据手册 Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DDR, DMA, PCIe CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU47DR-2FSVE1156I

XCZU47DR-2FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0
XCZU47DR-2FSVE1156I数据手册 Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB DMA, WDT CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 533MHz, 1.333GHz Zynq®UltraScale+™ FPGA, 930K+ Logic Cells -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
1SX280LU2F50E2LG

1SX280LU2F50E2LG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

0
1SX280LU2F50E2LG数据手册 Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX280LU3F50I2LG

1SX280LU3F50I2LG

IC SOC CORTEX-A53 1.5GHZ 2397BGA

Intel

0
1SX280LU3F50I2LG数据手册 Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
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分类概览

系统级芯片(SoC) 产品与选型指南

系统级芯片(SoC) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 系统级芯片(SoC)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 系统级芯片(SoC)?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

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