系统级芯片(SoC)

制造商 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装

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图片 制造商料号 库存情况 价格 数量 数据手册 系列 封装/外壳 包装 产品状态 架构 核心处理器 闪存大小 RAM 大小 外设 连接性 速度 主要属性 工作温度 等级 认证 供应商设备封装
1SX250HU3F50I2LG

1SX250HU3F50I2LG

IC FPGA STRATIX 10 2397FBGA

Intel

0
1SX250HU3F50I2LG数据手册 Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements -40°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
1SX250HU2F50E2LG

1SX250HU2F50E2LG

IC FPGA STRATIX 10 2397FBGA

Intel

0
1SX250HU2F50E2LG数据手册 Stratix® 10 SX 2397-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2500K Logic Elements 0°C ~ 100°C (TJ) - - 2397-FBGA, FC (50x50)
AGFC019R24C2E1VB

AGFC019R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

0
AGFC019R24C2E1VB数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFC019R24C2E1V

AGFC019R24C2E1V

AGFC019R24C2E1V

Intel

0
AGFC019R24C2E1V数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD019R24C2E1VB

AGFD019R24C2E1VB

IC FPGA AGILEX-F 2340BGA

Intel

0
AGFD019R24C2E1VB数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFD019R24C2E1V

AGFD019R24C2E1V

AGFD019R24C2E1V

Intel

0
AGFD019R24C2E1V数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 1.9M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
AGFA023R24C3E4X

AGFA023R24C3E4X

IC FPGA AGILEX-F 2340BGA

Intel

0
AGFA023R24C3E4X数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
1SX280HN1F43E1VGAS

1SX280HN1F43E1VGAS

IC FPGA STRATIX 10 1760FBGA

Intel

0
1SX280HN1F43E1VGAS数据手册 Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX280HN1F43E1VG

1SX280HN1F43E1VG

IC FPGA STRATIX 10 1760FBGA

Intel

0
1SX280HN1F43E1VG数据手册 Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
1SX280HN1F43E1VGS3

1SX280HN1F43E1VGS3

IC FPGA STRATIX 10 1760FBGA

Intel

0
1SX280HN1F43E1VGS3数据手册 Stratix® 10 SX 1760-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.5GHz FPGA - 2800K Logic Elements 0°C ~ 100°C (TJ) - - 1760-FBGA (42.5x42.5)
AGFB023R24C3E4X

AGFB023R24C3E4X

IC FPGA AGILEX-F 2340BGA

Intel

0
AGFB023R24C3E4X数据手册 Agilex F 2340-BFBGA Exposed Pad Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.3M Logic Elements 0°C ~ 100°C (TJ) - - 2340-BGA (45x42)
XCZU67DR-2FFVE1156I

XCZU67DR-2FFVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0
XCZU67DR-2FFVE1156I数据手册 Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB - - 533MHz, 1.333GHz Zynq® UltraScale+™ RFSoC -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
XCZU67DR-2FSVE1156I

XCZU67DR-2FSVE1156I

IC ZUP RFSOC A53 FPGA 1156BGA

AMD

0
XCZU67DR-2FSVE1156I数据手册 Zynq® UltraScale+™ RFSoC 1156-BBGA, FCBGA Tray Active MCU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ - 256KB - - 533MHz, 1.333GHz Zynq® UltraScale+™ RFSoC -40°C ~ 100°C (TJ) - - 1156-FCBGA (35x35)
AGFA027R24C2E3VR2

AGFA027R24C2E3VR2

IC FPGA AGILEX-F 2340FBGA

Intel

0
AGFA027R24C2E3VR2数据手册 Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFA027R24C3I3E

AGFA027R24C3I3E

IC FPGA AGILEX-F 2340FBGA

Intel

0
AGFA027R24C3I3E数据手册 Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - -
AGFA027R24C2E3V

AGFA027R24C2E3V

IC FPGA AGILEX-F 2340FBGA

Intel

0
AGFA027R24C2E3V数据手册 Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E3VR2

AGFB027R24C2E3VR2

IC FPGA AGILEX-F 2340FBGA

Intel

0
AGFB027R24C2E3VR2数据手册 Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C2E3V

AGFB027R24C2E3V

IC FPGA AGILEX-F 2340FBGA

Intel

0
AGFB027R24C2E3V数据手册 Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
AGFB027R24C3I3E

AGFB027R24C3I3E

IC FPGA AGILEX-F 2340FBGA

Intel

0
AGFB027R24C3I3E数据手册 Agilex F - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements -40°C ~ 100°C (TJ) - - -
AGIB027R31B3E3E

AGIB027R31B3E3E

IC FPGA AGILEX-I 3184FBGA

Intel

0
AGIB027R31B3E3E数据手册 Agilex I - Tray Active MPU, FPGA Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point - 256KB DMA, WDT EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG 1.4GHz FPGA - 2.7M Logic Elements 0°C ~ 100°C (TJ) - - -
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分类概览

系统级芯片(SoC) 产品与选型指南

系统级芯片(SoC) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。

您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 系统级芯片(SoC)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。

FAQ

如何选择合适的 系统级芯片(SoC)?

建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。

页面上的库存信息是否可以直接采购?

库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。

找不到指定型号怎么办?

您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。

是否可以提供 Datasheet 和技术资料?

可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。

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