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可编程逻辑器件（PLD）

制造商	系列	封装/外壳	包装	产品状态	可编程	可编程类型	宏单元数量	电压 - 输入	速度	安装类型	供应商设备封装
Advanced Micro Lites Altera AMD Atmel Cypress Semiconductor Corp Harris Corporation Infineon Technologies Intel Lantiq Lattice Semiconductor Corporation Microchip Technology MMI National Semiconductor Renesas Rochester Electronics, LLC Texas Instruments Vantis	* - 16V8 20V8 22V10 EPIC™ GAL16LV8ZD GAL20V8Z GAL20VP8 GAL20XV10 GAL®16LV8 GAL®16LV8C GAL®16LV8D GAL®16V8 GAL®16VP8 GAL®18V10 GAL®20LV8 GAL®20RA10 GAL®20V8 GAL®20V8QS GAL®22CV10 GAL®22LV10 GAL®22V10 GAL®26CV12 GAL®26V12 IMPACT-X™ PAL® ispGAL™ ispGAL™22LV10 ispGAL™22V10 LatticeXP2™ PAL16L8 PAL16R4 PAL16R6 PAL16R8 PAL20L8 PAL20R4 PAL20R6 PAL22V10 PAL22V10C PALCE16V8 PAL® PAL® 20V8 PAL®C20	- 20-CDIP (0.300", 7.62mm) 20-CDIP (0.300", 7.62mm) Window 20-CFlatPack 20-CLCC 20-DIP 20-DIP (0.300", 7.62mm) 20-LCC (J-Lead) 20-PLCC 20-SOIC (0.295", 7.50mm Width) 20-TSSOP (0.173", 4.40mm Width) 24-CDIP 24-CDIP (0.300", 7.62mm) 24-CDIP (0.300", 7.62mm) Window 24-CFlatPack 24-DIP 24-DIP (0.300", 7.62mm) 24-DIP (0.600", 15.24mm) 24-SOIC (0.295", 7.50mm Width) 24-TSSOP (0.173", 4.40mm Width) 28-CLCC 28-DIP (0.300", 7.62mm) 28-LCC (J-Lead) 28-LCC Window (J-Lead) 28-PQCC 28-SSOP (0.209", 5.30mm Width) 32-CLCC, Window 32-VFQFN Exposed Pad 40-CDIP (0.600", 15.24mm) 40-DIP (0.600", 15.24mm) 84-LCC (J-Lead)	Box Bulk Tape & Reel (TR) Tray Tube	Active Obsolete	- Not Verified Verified	- EE PLD EPLD PAL PAL FLASH	- 10 12 16 192 24 32 4 6 8	- 3.3V 3V 3V ~ 3.6V 3V ~ 5.5V 4.5V ~ 5.25V 4.5V ~ 5.5V 4.75V ~ 5.25V 5V	- 10 ns 12 ns 125 ns 15 ns 2.3 ns 2.8 ns 20 ns 25 ns 30 ns 33 ns 35 ns 4 ns 4.5 ns 40 ns 45 ns 5 ns 55 ns 7 ns 7.5 ns	- Surface Mount Through Hole	- 20-CDIP 20-CFlatPack 20-CFP 20-CLCC 20-CLCC (8.89x8.89) 20-DIP 20-LCCC (8.89x8.89) 20-PDIP 20-PLCC (8.89x8.89) 20-PLCC (9x9) 20-SO 20-SOIC 20-TSSOP 24-CDIP 24-CFlatPack 24-DIP 24-PDIP 24-SOIC 24-SOP 24-TSSOP 28-CLCC 28-CLCC (11.43x11.43) 28-CLCC (13.97x8.89) 28-JLCC (11.43x11.43) 28-LCC (11.45x11.45) 28-LCCC (11.43x11.43) 28-PDIP 28-PLCC 28-PLCC (11.43x11.43) 28-PLCC (11.51x11.51) 28-PLCC (11.53x11.53) 28-SSOP 32-CLCC (13.97x11.43) 32-QFN (5x5) 32-QFNS (5x5) 40-CDIP 40-PDIP 84-PLCC (29.31x29.31)

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图片	制造商料号	库存情况	价格	数量	数据手册	系列	封装/外壳	包装	产品状态	可编程	可编程类型	宏单元数量	电压 - 输入	速度	安装类型	供应商设备封装
	PAL20R8BMJS/883B OT PLD, 20NS, PAL-TYPE, TTL Advanced Micro Devices	539	-	立即询价	数据手册	-	24-CDIP (0.300", 7.62mm)	Bulk	Active	Not Verified	PAL	8	4.5V ~ 5.5V	25 ns	Through Hole	24-CDIP
	PAL16C1MW883B ELECTRICALLY ERASABLE PAL DEVICE Advanced Micro Devices	984	-	立即询价	数据手册	-	20-CFlatPack	Bulk	Active	Not Verified	PAL	-	4.5V ~ 5.5V	35 ns	Surface Mount	20-CFlatPack
	PAL16H2MW883B ELECTRICALLY ERASABLE PAL DEVICE Advanced Micro Devices	307	-	立即询价	数据手册	-	20-CFlatPack	Bulk	Active	Not Verified	PAL	-	4.5V ~ 5.5V	35 ns	Surface Mount	20-CFlatPack
	PAL20R4-10/BLA OT PLD, 12NS, PAL-TYPE, TTL Advanced Micro Devices	210	-	立即询价	数据手册	-	24-CDIP (0.300", 7.62mm)	Bulk	Active	Not Verified	PAL	4	4.5V ~ 5.5V	10 ns	Through Hole	24-CDIP
	PAL16L8B-4ML/883B ELECTRICALLY ERASABLE PAL DEVICE Advanced Micro Devices	541	-	立即询价	数据手册	-	20-CLCC	Bulk	Active	Not Verified	PAL	8	4.5V ~ 5.5V	15 ns	Surface Mount	20-CLCC
	PAL16R4B-4MW/883B ELECTRICALLY ERASABLE PAL DEVICE Advanced Micro Devices	227	-	立即询价	数据手册	-	20-CFlatPack	Bulk	Active	Not Verified	PAL	4	4.5V ~ 5.5V	20 ns	Surface Mount	20-CFlatPack
	PAL16R8B-4ML/883B ELECTRICALLY ERASABLE PAL DEVICE Advanced Micro Devices	104	-	立即询价	数据手册	-	20-CLCC	Bulk	Active	Not Verified	PAL	8	4.5V ~ 5.5V	15 ns	Surface Mount	20-CLCC
	PAL16R8-12/B2A ELECTRICALLY ERASABLE PAL DEVICE Advanced Micro Devices	790	-	立即询价	数据手册	-	20-CLCC	Bulk	Active	Not Verified	PAL	8	4.5V ~ 5.5V	12 ns	Surface Mount	20-CLCC
	PAL16R8-10/B2A ELECTRICALLY ERASABLE PAL DEVICE Advanced Micro Devices	201	-	立即询价	数据手册	-	20-CLCC	Bulk	Active	Not Verified	PAL	8	4.5V ~ 5.5V	10 ns	Surface Mount	20-CLCC
	PAL20X10AML883B OT PLD, PAL-TYPE, TTL, CQCC28 Advanced Micro Devices	652	-	立即询价	数据手册	-	28-CLCC	Bulk	Active	Not Verified	PAL	10	4.5V ~ 5.5V	35 ns	Surface Mount	28-CLCC (11.43x11.43)

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