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| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CYT4DNJBDCQ1BZSGSTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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 数据手册
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327-LFBGA | Traveo™ T2G | Tray | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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CYT4DNJBLCQ1BZSGSTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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数据手册
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327-LFBGA | Traveo™ T2G | Tray | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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CYT4DNJBKCQ1BZSGSTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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数据手册
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327-LFBGA | Traveo™ T2G | Tray | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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R5F61613D50MHV32BIT MCU |
0 |
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数据手册
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- | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
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CYT4DNJBNCQ1BZSGSTTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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数据手册
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327-LFBGA | Traveo™ T2G | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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CYT4DNJBFCQ1BZSGSTTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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数据手册
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327-LFBGA | Traveo™ T2G | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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CYT4DNJBGCQ1BZSGSTTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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数据手册
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327-LFBGA | Traveo™ T2G | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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MCF5282CVF80IC MCU 32B 512KB FLASH 256MAPBGA |
0 |
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数据手册
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256-LBGA | MCF528x | Tray | Obsolete | Not Verified | Coldfire V2 | 32-Bit Single-Core | 80MHz | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | DMA, LVD, POR, PWM, WDT | 142 | 512KB (512K x 8) | FLASH | - | 64K x 8 | 2.7V ~ 3.6V | A/D 8x10b | External | -40°C ~ 85°C (TA) | - | - | Surface Mount | 256-MAPBGA (17x17) | |
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FS32R274KCK2VMMIC MCU 32BIT 2MB FLASH 257MAPBGA |
0 |
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数据手册
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257-LFBGA | S32R | Tray | Active | Not Verified | e200z4, e200z7 (2) | 32-Bit Tri-Core | 180MHz, 240MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire | POR, PWM, WDT | - | 2MB (2M x 8) | FLASH | 64K x 8 | 1.5M x 8 | 1.19V ~ 5.5V | A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 257-LFBGA (14x14) | |
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S5LS20206ASPGEQQ1IC MCU 16/32BIT 2MB FLSH 144LQFP |
0 |
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数据手册
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144-LQFP | Hercules™ TMS570 ARM® Cortex®-R | Tray | Not For New Designs | Not Verified | ARM® Cortex®-R4F | 16/32-Bit | 140MHz | CANbus, LINbus, SCI, SPI, UART/USART | DMA, POR | 68 | 2MB (2M x 8) | FLASH | - | 160K x 8 | 1.35V ~ 1.65V | A/D 20x12b | External | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 144-LQFP (20x20) | |
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DF70855AN80FPVIC MCU 32BIT 512KB FLSH 144LFQFP |
0 |
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数据手册
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144-LQFP | SuperH® SH7080 | Tray | Not For New Designs | Not Verified | SH-2 | 32-Bit Single-Core | 80MHz | EBI/EMI, FIFO, I2C, SCI, SSU | DMA, POR, PWM, WDT | 100 | 512KB (512K x 8) | FLASH | - | 32K x 8 | 3V ~ 5.5V | A/D 8x10b | Internal | -20°C ~ 85°C (TA) | - | - | Surface Mount | 144-LFQFP (20x20) | |
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PPC5121VY400IC MCU 32BIT ROMLESS 516FPBGA |
0 |
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数据手册
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516-BBGA | MPC51xx | Tray | Obsolete | Not Verified | e300 | 32-Bit Single-Core | 400MHz | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | DMA, WDT | 147 | - | ROMless | - | 128K x 8 | 1.08V ~ 3.6V | - | External | 0°C ~ 70°C (TA) | - | - | Surface Mount | 516-PBGA (27x27) | |
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HD6417727BP160CVIC MCU 32BIT ROMLESS 240LFBGA |
0 |
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数据手册
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240-LFBGA | SuperH® SH7700 | Tray | Active | Not Verified | SH-3 DSP | 32-Bit Single-Core | 160MHz | FIFO, SCI, SIO, SmartCard, USB | DMA, LCD, POR, WDT | 104 | - | ROMless | - | 32K x 8 | 1.7V ~ 2.05V | A/D 6x10b; D/A 2x8b | Internal | -20°C ~ 75°C (TA) | - | - | Surface Mount | 240-LFBGA (13x13) | |
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SPC5645BK0VLT1RIC MCU 32BIT 2MB FLASH 208TQFP |
0 |
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数据手册
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208-LQFP | MPC56xx Qorivva | Tape & Reel (TR) | Active | Not Verified | e200z4d | 32-Bit Single-Core | 120MHz | CANbus, I2C, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 177 | 2MB (2M x 8) | FLASH | 64K x 8 | 160K x 8 | 3V ~ 5.5V | A/D 33x10b, 10x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 208-TQFP (28x28) | |
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CYT4DNJBDCQ1BZSGSTTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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数据手册
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327-LFBGA | Traveo™ T2G | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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CYT4DNJBKCQ1BZSGSTTRAVEO-2 CLUST.2.5DGRAPH |
0 |
|
数据手册
|
327-LFBGA | Traveo™ T2G | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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CYT4DNJBLCQ1BZSGSTTRAVEO-2 CLUST.2.5DGRAPH |
0 |
|
数据手册
|
327-LFBGA | Traveo™ T2G | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Tri-Core | 100MHz, 320MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.19MB (6.19M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 327-FBGA (17x17) | |
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UPD70F3385M2GMA2-GAR-AXIC MCU 32BIT 1MB FLASH 176LQFP |
0 |
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数据手册
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176-LQFP | V850 | Tray | Active | - | V850ES | 32-Bit | 32MHz | CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART | DMA, LVD, POR, PWM, WDT | 152 | 1MB (1M x 8) | FLASH | 32K x 8 | 60K x 8 | 3.3V ~ 5.5V | A/D 40x10b SAR | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 176-LFQFP (24x24) | |
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DF2239FA20IVIC MCU 16BIT 384KB FLASH 100QFP |
0 |
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数据手册
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100-BFQFP | H8® H8S/2200 | Tray | Last Time Buy | Not Verified | H8S/2000 | 16-Bit | 20MHz | I2C, SCI, SmartCard | DMA, POR, PWM, WDT | 72 | 384KB (384K x 8) | FLASH | - | 32K x 8 | 2.7V ~ 3.6V | A/D 8x10b; D/A 2x8b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 100-QFP (14x14) | |
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SPC5748GSK1MKU6RIC MCU 32BIT 6MB FLASH 176LQFP |
0 |
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数据手册
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176-LQFP Exposed Pad | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z2, e200z4, e200z4 | 32-Bit Tri-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 129 | 6MB (6M x 8) | FLASH | - | 768K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 176-LQFP (24x24) |
分类概览
微控制器 产品与选型指南
微控制器 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品，方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 微控制器。如暂时没有找到完全匹配的型号，也可以提交询价，我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 微控制器？
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求，再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购？
库存会随供应情况变化。对于项目采购或批量需求，建议提交询价，以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办？
您可以提交型号和数量需求，我们可以协助查询缺货型号，并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料？
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料；如资料暂缺，也可以联系我们协助查找。
