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| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SPC5642AF2MLU1RIC MCU 32BIT 2MB FLASH 176LQFP |
0 |
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 数据手册
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176-LQFP | MPC56xx Qorivva | Tape & Reel (TR) | Active | Not Verified | e200z4 | 32-Bit Single-Core | 150MHz | CANbus, EBI/EMI, LINbus, SCI, SPI | DMA, POR, PWM, WDT | 84 | 2MB (2M x 8) | FLASH | - | 128K x 8 | 1.14V ~ 5.25V | A/D 40x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 176-LQFP (24x24) | |
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DS87C520-ENLIC MCU 8BIT 16KB OTP 44TQFP |
0 |
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数据手册
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44-TQFP | 87C | Tray | Obsolete | Not Verified | 8051 | 8-Bit | 33MHz | EBI/EMI, SIO, UART/USART | Power-Fail Reset, WDT | 32 | 16KB (16K x 8) | OTP | - | 1K x 8 | 4.5V ~ 5.5V | - | External | -40°C ~ 85°C (TA) | - | - | Surface Mount | 44-TQFP (10x10) | |
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LM3S2651-IBZ50-A2IC MCU 32BIT 128KB FLASH 108BGA |
0 |
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数据手册
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108-LFBGA | Stellaris® ARM® Cortex®-M3S 2000 | Tray | Not For New Designs | Not Verified | ARM® Cortex®-M3 | 32-Bit Single-Core | 50MHz | CANbus, I2C, IrDA, Microwire, SPI, SSI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 53 | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.25V ~ 2.75V | A/D 4x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 108-BGA (10x10) | |
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SPC58NG80E5QEC0XIC MCU 32BIT 4MB FLASH 144ETQFP |
0 |
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数据手册
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144-TQFP Exposed Pad | SPC58 | Tape & Reel (TR) | Active | Not Verified | e200z4 | 32-Bit Tri-Core | 180MHz | CANbus, Ethernet, FlexRay, I2C, LINbus, SPI | DMA, WDT | 64 | 4MB (4M x 8) | FLASH | 256 x 8 | 768 x 8 | 3.3V, 5V | - | Internal | -40°C ~ 150°C (TJ) | Automotive | AEC-Q100 | Surface Mount | 144-eTQFP (20x20) | |
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R7F7017154ABG-C#HC1IC MCU 32BIT 8MB FLASH 324FBGA |
0 |
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数据手册
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324-FBGA | RH850/F1x | Tape & Reel (TR) | Active | - | RH850G3KH | 32-Bit Dual-Core | 240MHz | CANbus, CSI, Ethernet, I2C, LINbus, SENT, SPI, UART/USART | DMA, LVD, PWM, WDT | 246 | 8MB (8M x 8) | FLASH | 256K x 8 | 1M x 8 | 3V ~ 5.5V | A/D 38x10b, 32x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 324-FBGA (19x19) | |
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CYT3DLBBBBQ1BZSGSTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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数据手册
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272-LFBGA | Traveo™ T2G | Tray | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Dual-Core | 100MHz, 240MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 135 | 4.06MB (4.06M x 8) | FLASH | 128K x 8 | 384K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 272-BGA (16x16) | |
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SP5746CHK0AMMJ6RIC MCU 32BIT 3MB FLSH 256MAPPBGA |
0 |
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数据手册
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256-LBGA | MPC57xx | Tape & Reel (TR) | Not For New Designs | Not Verified | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 256-MAPPBGA (17x17) | |
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SP5746CHK1AMMJ6RIC MCU 32BIT 3MB FLSH 256MAPPBGA |
0 |
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数据手册
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256-LBGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 3MB (3M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 256-MAPPBGA (17x17) | |
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R5F61668RN50BGVMCU 3V 1024K PB-FREE 176-LFBGA |
0 |
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数据手册
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176-LFBGA | H8® H8SX/1600 | Tray | Active | - | H8SX | 32-Bit | 50MHz | EBI/EMI, I2C, IrDA, SCI, UART/USART, USB | DMA, LVD, POR, PWM, WDT | 92 | 1MB (1M x 8) | FLASH | - | 56K x 8 | 3V ~ 3.6V | A/D 8x10b SAR; D/A 2x8b | External, Internal | -20°C ~ 75°C (TA) | - | - | Surface Mount | 176-LFBGA (13x13) | |
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PIC32MZ1064DAS176T-I/2JIC MCU 32BIT 1MB FLASH 176LQFP |
0 |
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数据手册
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176-LQFP Exposed Pad | PIC® 32MZ DAS | Tape & Reel (TR) | Active | Not Verified | MIPS32® microAptiv™ | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 120 | 1MB (1M x 8) | FLASH | - | 640K x 8 + 32MB DDR2 SDRAM | 1.7V ~ 1.9V | A/D 45x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 176-LQFP (20x20) | |
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PIC32MZ2025DAS176T-I/2JIC MCU 32BIT 2MB FLASH 176LQFP |
0 |
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数据手册
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176-LQFP Exposed Pad | PIC® 32MZ DAS | Tape & Reel (TR) | Active | Not Verified | MIPS32® microAptiv™ | 32-Bit Single-Core | 200MHz | CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT | 120 | 2MB (2M x 8) | FLASH | - | 256K x 8 + 32MB DDR2 SDRAM | 1.7V ~ 1.9V | A/D 45x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 176-LQFP (20x20) | |
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F28388DPTPSRIC MCU 32BIT 1MB FLASH 176LQFP |
0 |
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数据手册
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176-LQFP Exposed Pad | C2000™ C28x Fixed-Point | Tape & Reel (TR) | Active | - | C28x | 32-Bit Dual-Core | 200MHz | CANbus, Ethernet, I2C, McBSP, SCI, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 97 | 1MB (512K x 16) | FLASH | - | 216K x 8 | 1.14V ~ 1.26V | A/D 20x12b, 29x16b SAR; D/A 3x12b | Internal | -40°C ~ 125°C (TJ) | Automotive | AEC-Q100 | Surface Mount | 176-HLQFP (24x24) | |
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LM3S1608-IQC50-A2TIC MCU 32BIT 128KB FLASH 100LQFP |
0 |
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数据手册
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100-LQFP | Stellaris® ARM® Cortex®-M3S 1000 | Tape & Reel (TR) | Not For New Designs | Verified | ARM® Cortex®-M3 | 32-Bit Single-Core | 50MHz | I2C, IrDA, Microwire, SPI, SSI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 52 | 128KB (128K x 8) | FLASH | - | 32K x 8 | 2.25V ~ 2.75V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 100-LQFP (14x14) | |
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SPC5747CK1MMJ6RIC MCU 32BIT 4MB FLSH 256MAPPBGA |
0 |
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数据手册
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256-LBGA | MPC57xx | Tape & Reel (TR) | Active | Not Verified | e200z2, e200z4 | 32-Bit Dual-Core | 80MHz/160MHz | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | DMA, LVD, POR, WDT | 178 | 4MB (4M x 8) | FLASH | - | 512K x 8 | 3V ~ 5.5V | A/D 80x10b, 64x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 256-MAPPBGA (17x17) | |
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S9S12DG12F1MPVEIC MCU 16BIT 128KB FLASH 112LQFP |
0 |
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数据手册
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112-LQFP | HCS12 | Bulk | Last Time Buy | Not Verified | HCS12 | 16-Bit | 25MHz | CANbus, I2C, SCI, SPI | PWM, WDT | 91 | 128KB (128K x 8) | FLASH | 2K x 8 | 8K x 8 | 2.35V ~ 5.25V | A/D 16x10b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 112-LQFP (20x20) | |
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R5S72681W266FP#V0IC MCU 32BIT ROMLESS 208LQFP |
0 |
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数据手册
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208-LQFP | SuperH® SH7260 | Tray | Not For New Designs | Not Verified | SH2A-FPU | 32-Bit Single-Core | 266MHz | CANbus, EBI/EMI, I2C, IEBus, SCI, SIO, SPI, USB | DMA, POR, PWM, WDT | 111 | - | ROMless | - | 2.5M x 8 | 3V ~ 3.6V | A/D 6x10b | External | -20°C ~ 85°C (TA) | - | - | Surface Mount | - | |
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R7S910007CBG#AC0IC MCU 32BIT ROMLESS 320FBGA |
0 |
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数据手册
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320-FBGA | RZ/T1 | Tray | Active | Not Verified | ARM® Cortex®-R4F | 32-Bit Single-Core | 600MHz | CANbus, CSI, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | DMA, POR, PWM, WDT | 209 | - | ROMless | - | 1.5M x 8 | 1.14V ~ 3.6V | A/D 24x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 320-FBGA (17x17) | |
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F28M36H53C2ZWTSIC MCU 32BIT 512KB FLASH 289BGA |
0 |
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数据手册
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289-LFBGA | C2000™ C28x + ARM® Cortex® M3 Concerto™ | Tray | Obsolete | Not Verified | C28x/ARM® Cortex®-M3 | 32-Bit Dual-Core | 100MHz/150MHz | CANbus, EBI/EMI, Ethernet, I2C, IrDA, McBSP, SCI, SPI, SSI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 142 | 512KB/512KB | FLASH | - | 232KB | 1.14V ~ 3.63V | A/D 24x12b | Internal | -40°C ~ 125°C (TJ) | - | - | Surface Mount | 289-NFBGA (16x16) | |
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CYT3DLABBBQ1AESGSTTRAVEO-2 CLUST.2.5DGRAPH |
0 |
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数据手册
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216-LQFP Exposed Pad | Traveo™ T2G | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Dual-Core | 100MHz, 240MHz | CANbus, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LVD, Temp Sensor, WDT | 108 | 4.06MB (4.06M x 8) | FLASH | 128K x 8 | 384K x 8 | 2.7V ~ 5.5V | A/D 48x12b SAR | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 216-TEQFP (24x24) | |
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MCF54453VP266IC MCU 32BIT ROMLESS 360BGA |
0 |
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数据手册
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360-BBGA | MCF5445x | Tray | Active | Not Verified | Coldfire V4 | 32-Bit Single-Core | 266MHz | I2C, SPI, SSI, UART/USART, USB OTG | DMA, WDT | 132 | - | ROMless | - | 32K x 8 | 1.35V ~ 3.6V | - | External, Internal | 0°C ~ 70°C (TA) | - | - | Surface Mount | 360-BGA (23x23) |
分类概览
微控制器 产品与选型指南
微控制器 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品，方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 微控制器。如暂时没有找到完全匹配的型号，也可以提交询价，我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 微控制器？
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求，再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购？
库存会随供应情况变化。对于项目采购或批量需求，建议提交询价，以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办？
您可以提交型号和数量需求，我们可以协助查询缺货型号，并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料？
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料；如资料暂缺，也可以联系我们协助查找。
