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| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC9S08AC8MFDEIC MCU 8BIT 8KB FLASH 48QFN NXP USA Inc. |
0 |
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 数据手册
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48-VFQFN Exposed Pad | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | 38 | 8KB (8K x 8) | FLASH | - | 768 x 8 | 2.7V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 48-QFN-EP (7x7) | |
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MC9S08EL32CTJIC MCU 8BIT 32KB FLASH 20TSSOP NXP USA Inc. |
0 |
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数据手册
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20-TSSOP (0.173", 4.40mm Width) | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 40MHz | I2C, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 16 | 32KB (32K x 8) | FLASH | 512 x 8 | 1K x 8 | 2.7V ~ 5.5V | A/D 12x10b | External | -40°C ~ 85°C (TA) | - | - | Surface Mount | 20-TSSOP | |
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LPC1345FHN33,551IC MCU 32BIT 32KB FLASH 32HVQFN NXP USA Inc. |
0 |
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数据手册
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32-VQFN Exposed Pad | LPC13xx | Tray | Active | Not Verified | ARM® Cortex®-M3 | 32-Bit Single-Core | 72MHz | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | Brown-out Detect/Reset, POR, WDT | 26 | 32KB (32K x 8) | FLASH | 2K x 8 | 10K x 8 | 2V ~ 3.6V | A/D 8x12b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 32-HVQFN (7x7) | |
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MC68HC705P6ACPIC MCU 8BIT 4.5KB OTP 28DIP NXP USA Inc. |
0 |
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数据手册
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28-DIP (0.600", 15.24mm) | HC05 | Tube | Obsolete | Not Verified | HC05 | 8-Bit | 2.1MHz | SIO | POR, WDT | 21 | 4.5KB (4.5K x 8) | OTP | - | 176 x 8 | 3V ~ 5.5V | A/D 4x8b | Internal | -40°C ~ 85°C (TA) | - | - | Through Hole | 28-PDIP | |
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S9S12G96ACLLIC MCU 16BIT 96KB FLASH 100LQFP NXP USA Inc. |
0 |
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数据手册
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100-LQFP | HCS12 | Tray | Active | Not Verified | 12V1 | 16-Bit | 25MHz | CANbus, IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 86 | 96KB (96K x 8) | FLASH | 3K x 8 | 8K x 8 | 3.13V ~ 5.5V | A/D 12x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 100-LQFP (14x14) | |
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MC908QY4CDTERIC MCU 8BIT 4KB FLASH 16TSSOP NXP USA Inc. |
0 |
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数据手册
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16-TSSOP (0.173", 4.40mm Width) | HC08 | Tape & Reel (TR) | Not For New Designs | Not Verified | HC08 | 8-Bit | 8MHz | - | LVD, POR, PWM | 13 | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 5.5V | A/D 4x8b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 16-TSSOP | |
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MKL16Z256VMP4RIC MCU 32BIT 256KB FLSH 64MAPBGA NXP USA Inc. |
0 |
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数据手册
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64-LFBGA | Kinetis KL1 | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, LINbus, SPI, TSI, UART/USART | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 54 | 256KB (256K x 8) | FLASH | - | 32K x 8 | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 64-MAPBGA (5x5) | |
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MC908GP16CFBEIC MCU 8BIT 16KB FLASH 44QFP NXP USA Inc. |
0 |
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数据手册
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44-QFP | HC08 | Tray | Obsolete | Not Verified | HC08 | 8-Bit | 8MHz | SCI, SPI | LVD, POR, PWM | 33 | 16KB (16K x 8) | FLASH | - | 512 x 8 | 2.7V ~ 5.5V | A/D 8x8b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 44-QFP (10x10) | |
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MCF51AC128CVPUEIC MCU 32BIT 128KB FLASH 64LQFP NXP USA Inc. |
0 |
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数据手册
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64-LQFP | MCF51AC | Tray | Obsolete | Not Verified | Coldfire V1 | 32-Bit Single-Core | 50MHz | I2C, SCI, SPI | LVD, PWM, WDT | 54 | 128KB (128K x 8) | FLASH | - | 16K x 8 | 2.7V ~ 5.5V | A/D 20x12b | External | -40°C ~ 105°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) | |
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S912ZVC64F0CLFRIC MCU 16BIT 64KB FLASH 48LQFP NXP USA Inc. |
0 |
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数据手册
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48-LQFP | S12 MagniV | Tape & Reel (TR) | Active | Not Verified | S12Z | 16-Bit | 32MHz | CANbus, I2C, SCI, SPI | DMA, POR, PWM, WDT | 28 | 64KB (64K x 8) | FLASH | 1K x 8 | 4K x 8 | 3.5V ~ 40V | A/D 10x10b; D/A 1x8b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 48-LQFP (7x7) |
