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| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应（Vcc/Vdd） | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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S9S12ZVLS1ACFMRS12Z CPU, 16K FLASH NXP USA Inc. |
0 |
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 数据手册
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32-VFQFN Exposed Pad | S12 MagniV | Tape & Reel (TR) | Active | - | S12Z | 16-Bit | 32MHz | I2C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 18 | 16KB (16K x 8) | FLASH | 128 x 8 | 1K x 8 | 5.5V ~ 18V | A/D 6x10b | External, Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount, Wettable Flank | 32-QFN-EP (5x5) | |
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S9S08RNA48W1MLCIC MCU 8BIT 48KB FLASH 32LQFP NXP USA Inc. |
0 |
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数据手册
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32-LQFP | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 26 | 48KB (48K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
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MC68HC908JK3ECDWIC MCU 8BIT 4KB FLASH 20SOIC NXP USA Inc. |
0 |
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数据手册
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20-SOIC (0.295", 7.50mm Width) | HC08 | Tube | Obsolete | Not Verified | HC08 | 8-Bit | 8MHz | - | LED, LVD, POR, PWM | 15 | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 3.3V | A/D 12x8b | External | -40°C ~ 85°C (TA) | - | - | Surface Mount | 20-SOIC | |
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MC908JK3CDWEIC MCU 8BIT 4KB FLASH 20SOIC NXP USA Inc. |
0 |
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数据手册
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20-SOIC (0.295", 7.50mm Width) | HC08 | Tube | Obsolete | Not Verified | HC08 | 8-Bit | 8MHz | - | LED, LVD, POR, PWM | 15 | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7V ~ 3.3V | A/D 12x8b | External | -40°C ~ 85°C (TA) | - | - | Surface Mount | 20-SOIC | |
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S9S12GN16J0MLFRIC MCU 16BIT 16KB FLASH 48LQFP NXP USA Inc. |
0 |
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数据手册
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48-LQFP | HCS12 | Tape & Reel (TR) | Active | - | S12 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 40 | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 48-LQFP (7x7) | |
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S9S12GN16J1MLCRIC MCU 16BIT 16KB FLASH 32LQFP NXP USA Inc. |
0 |
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数据手册
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32-LQFP | HCS12 | Tape & Reel (TR) | Active | - | S12 | 16-Bit | 25MHz | IrDA, LINbus, SCI, SPI | LVD, POR, PWM, WDT | 26 | 16KB (16K x 8) | FLASH | 512 x 8 | 1K x 8 | 3.13V ~ 5.5V | A/D 8x10b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
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S9S12ZVL16AVLCS12Z CPU, 16K FLASH NXP USA Inc. |
0 |
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数据手册
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32-LQFP | S12 MagniV | Tray | Active | - | S12Z | 16-Bit | 32MHz | I2C, IrDA, LINbus, SCI, SPI, UART/USART | LVD, POR, PWM, WDT | 19 | 16KB (16K x 8) | FLASH | 128 x 8 | 1K x 8 | 3.5V ~ 40V | A/D 6x10b | External, Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
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MC68HC705J1ACPIC MCU 8BIT 1.2KB OTP 20DIP NXP USA Inc. |
0 |
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数据手册
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20-DIP (0.300", 7.62mm) | HC05 | Tube | Obsolete | Not Verified | HC05 | 8-Bit | 4MHz | - | POR, WDT | 14 | 1.2KB (1.2K x 8) | OTP | - | 64 x 8 | 3V ~ 5.5V | - | Internal | -40°C ~ 85°C (TA) | - | - | Through Hole | 20-DIP | |
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MKL26Z64VFT4RIC MCU 32BIT 64KB FLASH 48QFN NXP USA Inc. |
0 |
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数据手册
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48-VFQFN Exposed Pad | Kinetis KL2 | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 48MHz | I2C, LINbus, SPI, UART/USART, USB, USB OTG | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 36 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 1.71V ~ 3.6V | A/D - 16bit; D/A - 12bit | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 48-QFN (7x7) | |
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C9KEAZ64AMLHC9KEAZ64AMLH NXP USA Inc. |
0 |
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数据手册
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64-LQFP | Kinetis KEA | Bulk | Active | - | ARM® Cortex®-M0+ | 32-Bit | 48MHz | CANbus, I2C, SPI, UART/USART | LVD, PMC, PWM, WDT | 58 | 64KB (64K x 8) | FLASH | - | 8K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 64-LQFP (10x10) |
