微控制器
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 封装/外壳 | 系列 | 包装 | 产品状态 | 可编程 | 核心处理器 | 核心大小 | 速度 | 连接性 | 外设 | I/O 数量 | 程序存储器大小 | 程序存储器类型 | EEPROM 大小 | RAM 大小 | 电压 - 供应(Vcc/Vdd) | 数据转换器 | 振荡器类型 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC9S08QG4CDNERIC MCU 8BIT 4KB FLASH 8SOIC NXP USA Inc. |
0 |
|
|
8-SOIC (0.154", 3.90mm Width) | S08 | Tape & Reel (TR) | Active | Not Verified | S08 | 8-Bit | 20MHz | I2C, SCI, SPI | LVD, POR, PWM, WDT | 4 | 4KB (4K x 8) | FLASH | - | 256 x 8 | 1.8V ~ 3.6V | A/D 4x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 8-SOIC | |
|
MC9S08PT32AVLFIC MCU 8BIT 32KB FLASH 48LQFP NXP USA Inc. |
0 |
|
|
48-LQFP | S08 | Tray | Active | Not Verified | S08 | 8-Bit | 20MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 41 | 32KB (32K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount | 48-LQFP (7x7) | |
|
S9KEAZN64ACLCRKINETIS E SERIES 64K FLASH 4K RA NXP USA Inc. |
0 |
|
|
32-LQFP | - | Tape & Reel (TR) | Active | - | ARM® Cortex®-M0+ | 32-Bit | 40MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 28 | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR | External, Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
|
LPC1114FHN33/302,5IC MCU 32BIT 32KB FLASH 32HVQFN NXP USA Inc. |
0 |
|
|
32-VQFN Exposed Pad | LPC1100L | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 28 | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 32-HVQFN (7x7) | |
|
LPC1114FHN33/303YIC MCU 32BIT 32KB FLASH 32HVQFN NXP USA Inc. |
0 |
|
|
32-VQFN Exposed Pad | LPC1100XL | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 28 | 32KB (32K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 32-HVQFN (7x7) | |
|
LPC1113FHN33/302,5IC MCU 32BIT 24KB FLASH 32HVQFN NXP USA Inc. |
0 |
|
|
32-VQFN Exposed Pad | LPC1100L | Tray | Active | Not Verified | ARM® Cortex®-M0 | 32-Bit Single-Core | 50MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, WDT | 28 | 24KB (24K x 8) | FLASH | - | 8K x 8 | 1.8V ~ 3.6V | A/D 8x10b | Internal | -40°C ~ 85°C (TA) | - | - | Surface Mount | 32-HVQFN (7x7) | |
|
S9KEAZN64AMLCRIC MCU 32BIT 64KB FLASH 32LQFP NXP USA Inc. |
0 |
|
|
32-LQFP | Kinetis KEA | Tape & Reel (TR) | Active | Not Verified | ARM® Cortex®-M0+ | 32-Bit Single-Core | 40MHz | I2C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 28 | 64KB (64K x 8) | FLASH | 256 x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 32-TQFP (7x7) | |
|
C9KEAZN64AMLCRC9KEAZN64AMLCR NXP USA Inc. |
0 |
|
|
32-LQFP | Kinetis KEA | Bulk | Active | - | ARM® Cortex®-M0+ | 32-Bit | 40MHz | I2C, SPI, UART/USART | LVD, PMC, PWM, WDT | 57 | 64KB (64K x 8) | FLASH | 256K x 8 | 4K x 8 | 2.7V ~ 5.5V | A/D 16x12b SAR | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | 32-LQFP (7x7) | |
|
S9KEAZN16BMLCRIC MCU NXP USA Inc. |
0 |
|
|
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
S9KEAZN64BMLCRIC MCU NXP USA Inc. |
0 |
|
|
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
