现场可编程门阵列(FPGA)
| 图片 | 制造商料号 | 库存情况 | 数量 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 可编程 | LABs/CLBs 数量 | 逻辑元件/单元数量 | 总 RAM 位数 | I/O 数量 | 门数 | 电压 - 电源 | 安装类型 | 工作温度 | 等级 | 认证 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
EP4CE55F29C6NIC FPGA 374 I/O 780FBGA |
0 |
|
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Cyclone® IV E | 780-BGA | Tray | Active | Not Verified | 3491 | 55856 | 2396160 | 374 | - | 1.15V ~ 1.25V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 780-FBGA (29x29) |
|
EP4CE55F29I7NIC FPGA 374 I/O 780FBGA |
0 |
|
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Cyclone® IV E | 780-BGA | Tray | Active | Not Verified | 3491 | 55856 | 2396160 | 374 | - | 1.15V ~ 1.25V | Surface Mount | -40°C ~ 100°C (TJ) | - | - | 780-FBGA (29x29) |
|
EP4CE55F29I8LNIC FPGA 374 I/O 780FBGA |
0 |
|
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Cyclone® IV E | 780-BGA | Tray | Active | Not Verified | 3491 | 55856 | 2396160 | 374 | - | 0.97V ~ 1.03V | Surface Mount | -40°C ~ 100°C (TJ) | - | - | 780-FBGA (29x29) |
|
|
XC3S4000-5FGG676CIC FPGA 489 I/O 676FBGA |
0 |
|
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Spartan®-3 | 676-BGA | Tray | Obsolete | Not Verified | 6912 | 62208 | 1769472 | 489 | 4000000 | 1.14V ~ 1.26V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
|
XC6SLX100T-2CSG484CIC FPGA 296 I/O 484CSBGA |
0 |
|
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Spartan®-6 LXT | 484-FBGA, CSPBGA | Tray | Active | Not Verified | 7911 | 101261 | 4939776 | 296 | - | 1.14V ~ 1.26V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 484-CSPBGA (19x19) |
|
XC6SLX100T-2FGG484CIC FPGA 296 I/O 484FBGA |
0 |
|
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Spartan®-6 LXT | 484-BBGA | Tray | Active | Not Verified | 7911 | 101261 | 4939776 | 296 | - | 1.14V ~ 1.26V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 484-FBGA (23x23) |
|
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M1A3PE1500-1FGG676IC FPGA 444 I/O 676FBGA |
0 |
|
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ProASIC3E | 676-BGA | Tray | Active | Not Verified | - | - | 276480 | 444 | 1500000 | 1.425V ~ 1.575V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
|
M1A3PE1500-1FG676IC FPGA 444 I/O 676FBGA |
0 |
|
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ProASIC3E | 676-BGA | Tray | Active | Not Verified | - | - | 276480 | 444 | 1500000 | 1.425V ~ 1.575V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
|
A3PE1500-1FG676IC FPGA 444 I/O 676FBGA |
0 |
|
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ProASIC3E | 676-BGA | Tray | Active | Not Verified | - | - | 276480 | 444 | 1500000 | 1.425V ~ 1.575V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
|
|
A3PE1500-1FGG676IC FPGA 444 I/O 676FBGA |
0 |
|
|
ProASIC3E | 676-BGA | Tray | Active | Not Verified | - | - | 276480 | 444 | 1500000 | 1.425V ~ 1.575V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 676-FBGA (27x27) |
|
A54SX16-TQG176IC FPGA 147 I/O 176TQFP |
0 |
|
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SX | 176-LQFP | Tray | Active | Not Verified | 1452 | - | - | 147 | 24000 | 3V ~ 3.6V, 4.75V ~ 5.25V | Surface Mount | 0°C ~ 70°C (TA) | - | - | 176-TQFP (24x24) |
|
M1A3PE1500-1PQG208IIC FPGA 147 I/O 208QFP |
0 |
|
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ProASIC3E | 208-BFQFP | Tray | Active | Not Verified | - | - | 276480 | 147 | 1500000 | 1.425V ~ 1.575V | Surface Mount | -40°C ~ 100°C (TJ) | - | - | 208-PQFP (28x28) |
|
A3PE1500-1PQG208IIC FPGA 147 I/O 208QFP |
0 |
|
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ProASIC3E | 208-BFQFP | Tray | Active | Not Verified | - | - | 276480 | 147 | 1500000 | 1.425V ~ 1.575V | Surface Mount | -40°C ~ 100°C (TJ) | - | - | 208-PQFP (28x28) |
|
EP4CGX50DF27C7NIC FPGA 310 I/O 672FBGA |
0 |
|
|
Cyclone® IV GX | 672-BGA | Tray | Active | Not Verified | 3118 | 49888 | 2562048 | 310 | - | 1.16V ~ 1.24V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 672-FBGA (27x27) |
|
M7AFS600-1FG256IC FPGA 119 I/O 256FBGA |
0 |
|
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Fusion® | 256-LBGA | Tray | Active | Not Verified | - | - | 110592 | 119 | 600000 | 1.425V ~ 1.575V | Surface Mount | 0°C ~ 70°C (TA) | - | - | 256-FPBGA (17x17) |
|
M7AFS600-1FGG256IC FPGA 119 I/O 256FBGA |
0 |
|
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Fusion® | 256-LBGA | Tray | Active | Not Verified | - | - | 110592 | 119 | 600000 | 1.425V ~ 1.575V | Surface Mount | 0°C ~ 70°C (TA) | - | - | 256-FPBGA (17x17) |
|
5CGTFD5C5M13C7NIC FPGA 175 I/O 383MBGA |
0 |
|
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Cyclone® V GT | 383-TFBGA | Tray | Active | Not Verified | 29080 | 77000 | 5001216 | 175 | - | 1.07V ~ 1.13V | Surface Mount | 0°C ~ 85°C (TJ) | - | - | 383-MBGA (13x13) |
|
TI240C1156C3LLINEAR IC |
0 |
|
|
- | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
TI240C1156I3LINEAR IC |
0 |
|
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- | - | Tray | Active | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
XC4VLX15-10SFG363IIC FPGA 240 I/O 363FCBGA |
0 |
|
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Virtex®-4 LX | 363-FBGA, FCBGA | Tray | Active | Not Verified | 1536 | 13824 | 884736 | 240 | - | 1.14V ~ 1.26V | Surface Mount | -40°C ~ 100°C (TJ) | - | - | 363-FCBGA (17x17) |
分类概览
现场可编程门阵列(FPGA) 产品与选型指南
现场可编程门阵列(FPGA) 广泛应用于工业控制、汽车电子、通信设备、消费电子、新能源及其他电子系统。我们提供多品牌、多封装及不同规格的相关产品,方便工程师、采购人员和研发团队进行型号筛选、参数比较和采购询价。
您可以根据制造商、关键参数、库存情况及 Datasheet 信息筛选适合的 现场可编程门阵列(FPGA)。如暂时没有找到完全匹配的型号,也可以提交询价,我们将协助确认库存、交期以及可替代型号。
FAQ
如何选择合适的 现场可编程门阵列(FPGA)?
建议先确认电气参数、封装、工作温度、应用环境以及品牌要求,再结合库存和交期进行筛选。
页面上的库存信息是否可以直接采购?
库存会随供应情况变化。对于项目采购或批量需求,建议提交询价,以便进一步确认实时库存、价格和交期。
找不到指定型号怎么办?
您可以提交型号和数量需求,我们可以协助查询缺货型号,并根据参数提供可替代型号建议。
是否可以提供 Datasheet 和技术资料?
可以。产品列表中的 Datasheet 链接可用于查看相关技术资料;如资料暂缺,也可以联系我们协助查找。
